Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 2024年第一季度报告披露提示性公告 | 2024-04-25 | Chinese | |
| 2024年一季度报告 | 2024-04-25 | Chinese | |
| 第五届监事会第七次会议决议公告 | 2024-04-25 | Chinese | |
| 第五届董事会第八次会议决议公告 | 2024-04-25 | Chinese | |
| 关于签订募集资金四方监管协议的公告 | 2024-04-22 | Chinese | |
| 2023年年度权益分派实施公告 | 2024-04-19 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2024
15 filings
| |||||
| 37284558 | 2024年第一季度报告披露提示性公告 | 2024-04-25 | Chinese | ||
| 37284548 | 2024年一季度报告 | 2024-04-25 | Chinese | ||
| 37284527 | 第五届监事会第七次会议决议公告 | 2024-04-25 | Chinese | ||
| 37284509 | 第五届董事会第八次会议决议公告 | 2024-04-25 | Chinese | ||
| 37284497 | 关于签订募集资金四方监管协议的公告 | 2024-04-22 | Chinese | ||
| 37284486 | 2023年年度权益分派实施公告 | 2024-04-19 | Chinese | ||
| 37284473 | 2023年年度股东大会决议公告 | 2024-04-17 | Chinese | ||
| 37284455 | 2023年年度股东大会的法律意见书 | 2024-04-17 | Chinese | ||
| 37284423 | 关于部分限制性股票回购注销完成的公告 | 2024-04-17 | Chinese | ||
| 37284409 | 关于召开2023年年度股东大会的提示性公告 | 2024-04-15 | Chinese | ||
| 37284399 | 2024年第四次临时股东大会决议公告 | 2024-04-10 | Chinese | ||
| 37284392 | 关于控股子公司与北京怀柔经信局签署《合作协议》的进展公告 | 2024-04-10 | Chinese | ||
| 37284385 | 关于签订募集资金四方监管协议补充协议的公告 | 2024-04-10 | Chinese | ||
| 37284379 | 关于与北京市怀柔区人民政府签署《战略合作协议》的公告 | 2024-04-10 | Chinese | ||
| 37284370 | 2024年第四次临时股东大会的法律意见书 | 2024-04-10 | Chinese | ||
Market data
Market data not available
Price history
Peer group · Manufacture of other electronic components and boards
| Company | Ticker | Country | Sector |
|---|---|---|---|
|
3ALogics. Inc.
Designs and develops NFC and RFID System-on-Chips (SoCs) fo…
|
177900 | KR | Manufacturing |
|
3peak Incorporated
Designs analog and mixed-signal ICs for signal chain and po…
|
688536 | CN | Manufacturing |
|
4DS MEMORY LIMITED
Develops Interface Switching ReRAM for high-density Storage…
|
4DS | AU | Manufacturing |
|
AAC Technologies Holdings Inc.
Global provider of sensory solutions and miniaturized compo…
|
2018 | KY | Manufacturing |
|
ABCO ELECTRONICS CO., LTD.
Manufacturer of passive electronic components like inductor…
|
036010 | KR | Manufacturing |
|
Abonmax Co., Ltd.
Develops AI-driven systems, UAVs, electronic components, an…
|
2429 | TW | Manufacturing |
|
ABOV Semiconductor Co.,Ltd.
Designs and manufactures MCUs, touch sensors, and non-volat…
|
102120 | KR | Manufacturing |
|
ACBEL POLYTECH INC.
Designs and manufactures switching power supplies for 5G, m…
|
6282 | TW | Manufacturing |
|
Accelink Technologies Co., Ltd.
Produces optoelectronic components and modules for telecom …
|
002281 | CN | Manufacturing |
|
ACES ELECTRONICS CO., LTD.
Global provider of high-precision electronic components and…
|
3605 | TW | Manufacturing |
Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
Report missing filing
Can't find a specific document? Let us know and we'll add it within 24 hours.