Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 董事会议事规则（2024年3月） | 2024-03-26 | Chinese | |
| 关于2023年年度计提资产减值准备的公告 | 2024-03-26 | Chinese | |
| 董事会对独董独立性评估的专项意见 | 2024-03-26 | Chinese | |
| 董事会决议公告 | 2024-03-26 | Chinese | |
| 关于召开2023年年度股东大会的通知 | 2024-03-26 | Chinese | |
| 关于2023年度募集资金存放与使用情况的专项报告 | 2024-03-26 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2024
15 filings
| |||||
| 37283727 | 董事会议事规则（2024年3月） | 2024-03-26 | Chinese | ||
| 37283719 | 关于2023年年度计提资产减值准备的公告 | 2024-03-26 | Chinese | ||
| 37283711 | 董事会对独董独立性评估的专项意见 | 2024-03-26 | Chinese | ||
| 37283709 | 董事会决议公告 | 2024-03-26 | Chinese | ||
| 37283699 | 关于召开2023年年度股东大会的通知 | 2024-03-26 | Chinese | ||
| 37283690 | 关于2023年度募集资金存放与使用情况的专项报告 | 2024-03-26 | Chinese | ||
| 37283676 | 关于聘任2024年度审计机构的公告 | 2024-03-26 | Chinese | ||
| 37283668 | 关于开展外汇衍生品交易业务的公告 | 2024-03-26 | Chinese | ||
| 37283660 | 2023年度独立董事述职报告（景贵飞） | 2024-03-26 | Chinese | ||
| 37283653 | 2023年度独立董事述职报告（付三中） | 2024-03-26 | Chinese | ||
| 37283644 | 2023年度募集资金存放与使用情况鉴证报告 | 2024-03-26 | Chinese | ||
| 37283628 | 2023年年度报告摘要 | 2024-03-26 | Chinese | ||
| 37283610 | 2023年年度审计报告 | 2024-03-26 | Chinese | ||
| 37283504 | 关于修订《公司章程》的公告 | 2024-03-26 | Chinese | ||
| 37283496 | 2023年度独立董事述职报告（刘婷） | 2024-03-26 | Chinese | ||
Market data
Market data not available
Price history
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Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
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