Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 2024年第四次临时股东大会的法律意见书 | 2024-04-10 | Chinese | |
| 关于召开2024年第四次临时股东大会的提示性公告 | 2024-04-07 | Chinese | |
| 中泰证券股份有限公司关于公司2023年度现场检查报告 | 2024-04-03 | Chinese | |
| 中泰证券股份有限公司关于公司2023年度持续督导跟踪报告 | 2024-04-03 | Chinese | |
| 中泰证券股份有限公司关于公司向特定对象发行股票之保荐总结报告书 | 2024-04-03 | Chinese | |
| 2023年度环境、社会及治理（ESG）报告 | 2024-03-26 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2024
15 filings
| |||||
| 37284370 | 2024年第四次临时股东大会的法律意见书 | 2024-04-10 | Chinese | ||
| 37284357 | 关于召开2024年第四次临时股东大会的提示性公告 | 2024-04-07 | Chinese | ||
| 37284350 | 中泰证券股份有限公司关于公司2023年度现场检查报告 | 2024-04-03 | Chinese | ||
| 37284339 | 中泰证券股份有限公司关于公司2023年度持续督导跟踪报告 | 2024-04-03 | Chinese | ||
| 37284333 | 中泰证券股份有限公司关于公司向特定对象发行股票之保荐总结报告书 | 2024-04-03 | Chinese | ||
| 37284320 | 2023年度环境、社会及治理（ESG）报告 | 2024-03-26 | Chinese | ||
| 37283840 | 2024年度董事、监事、高级管理人员薪酬方案 | 2024-03-26 | Chinese | ||
| 37283827 | 关于使用部分闲置自有资金进行现金管理的公告 | 2024-03-26 | Chinese | ||
| 37283814 | 前次募集资金存放与使用情况鉴证报告 | 2024-03-26 | Chinese | ||
| 37283800 | 2023年度内部控制自我评价报告 | 2024-03-26 | Chinese | ||
| 37283794 | 公司章程（2024年3月） | 2024-03-26 | Chinese | ||
| 37283782 | 2023年度董事会工作报告 | 2024-03-26 | Chinese | ||
| 37283769 | 中泰证券股份有限公司关于公司开展外汇衍生品交易业务的核查意见 | 2024-03-26 | Chinese | ||
| 37283756 | 关于开展外汇衍生品交易业务的可行性分析报告 | 2024-03-26 | Chinese | ||
| 37283745 | 2023年度独立董事述职报告（丛培国） | 2024-03-26 | Chinese | ||
Market data
Market data not available
Price history
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Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
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