Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 2023年度监事会工作报告 | 2024-03-26 | Chinese | |
| 2023年度财务决算报告 | 2024-03-26 | Chinese | |
| 未来三年（2024-2026年）股东回报规划 | 2024-03-22 | Chinese | |
| 关于公司最近五年未被证券监管部门和证券交易所采取监管措施或处罚的公告 | 2024-03-22 | Chinese | |
| 可转换公司债券持有人会议规则 | 2024-03-22 | Chinese | |
| 关于收购控股子公司部分股权暨关联交易的公告 | 2024-03-22 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2024
15 filings
| |||||
| 37283348 | 2023年度监事会工作报告 | 2024-03-26 | Chinese | ||
| 37283339 | 2023年度财务决算报告 | 2024-03-26 | Chinese | ||
| 37283331 | 未来三年（2024-2026年）股东回报规划 | 2024-03-22 | Chinese | ||
| 37283322 | 关于公司最近五年未被证券监管部门和证券交易所采取监管措施或处罚的公告 | 2024-03-22 | Chinese | ||
| 37283315 | 可转换公司债券持有人会议规则 | 2024-03-22 | Chinese | ||
| 37283304 | 关于收购控股子公司部分股权暨关联交易的公告 | 2024-03-22 | Chinese | ||
| 37283291 | 关于尚无法提供前次募集资金使用情况报告的说明的公告 | 2024-03-22 | Chinese | ||
| 37283274 | 关于召开2024年第四次临时股东大会的通知 | 2024-03-22 | Chinese | ||
| 37283259 | 关于向不特定对象发行可转换公司债券预案披露的提示性公告 | 2024-03-22 | Chinese | ||
| 37283248 | 向不特定对象发行可转换公司债券预案 | 2024-03-22 | Chinese | ||
| 37283226 | 第五届监事会第五次会议决议公告 | 2024-03-22 | Chinese | ||
| 37283214 | 向不特定对象发行可转换公司债券募集资金使用的可行性分析报告 | 2024-03-22 | Chinese | ||
| 37283191 | 第五届董事会第六次会议决议公告 | 2024-03-22 | Chinese | ||
| 37283181 | 关于向不特定对象发行可转换公司债券摊薄即期回报与公司拟采取填补措施及相关主体的承诺公告 | 2024-03-22 | Chinese | ||
| 37283167 | 关于向不特定对象发行可转换公司债券的论证分析报告 | 2024-03-22 | Chinese | ||
Market data
Market data not available
Price history
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Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
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