Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 关于向不特定对象发行可转换公司债券的论证分析报告 | 2024-03-22 | Chinese | |
| 关于控股股东股票质押式回购交易提前购回的公告 | 2024-03-20 | Chinese | |
| 关于控股子公司完成工商变更登记的公告 | 2024-03-19 | Chinese | |
| 关于增持武汉光谷信息技术股份有限公司股权过户完成的公告 | 2024-03-08 | Chinese | |
| 关于回购注销部分限制性股票的减资公告 | 2024-02-27 | Chinese | |
| 2024年第三次临时股东大会的法律意见书 | 2024-02-27 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2024
15 filings
| |||||
| 37283167 | 关于向不特定对象发行可转换公司债券的论证分析报告 | 2024-03-22 | Chinese | ||
| 37283149 | 关于控股股东股票质押式回购交易提前购回的公告 | 2024-03-20 | Chinese | ||
| 37283142 | 关于控股子公司完成工商变更登记的公告 | 2024-03-19 | Chinese | ||
| 37283133 | 关于增持武汉光谷信息技术股份有限公司股权过户完成的公告 | 2024-03-08 | Chinese | ||
| 37283124 | 关于回购注销部分限制性股票的减资公告 | 2024-02-27 | Chinese | ||
| 37283117 | 2024年第三次临时股东大会的法律意见书 | 2024-02-27 | Chinese | ||
| 37283107 | 2024年第三次临时股东大会决议公告 | 2024-02-27 | Chinese | ||
| 37283097 | 关于“质量回报双提升”行动方案的公告 | 2024-02-27 | Chinese | ||
| 37283088 | 关于召开2024年第三次临时股东大会的提示性公告 | 2024-02-22 | Chinese | ||
| 37283078 | 第五届董事会第五次会议决议公告 | 2024-02-06 | Chinese | ||
| 37283070 | 关于部分募投项目增加实施主体及实施地点的公告 | 2024-02-06 | Chinese | ||
| 37283060 | 关于使用募集资金向控股子公司出资用于募投项目的公告 | 2024-02-06 | Chinese | ||
| 37283048 | 关于作废部分已授予但尚未归属的限制性股票的公告 | 2024-02-06 | Chinese | ||
| 37283041 | 第五届监事会第四次会议决议公告 | 2024-02-06 | Chinese | ||
| 37283028 | 公司章程（2024年2月） | 2024-02-06 | Chinese | ||
Market data
Market data not available
Price history
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Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
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