Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 2024年第一次临时股东大会决议公告 | 2024-01-03 | Chinese | |
| 关于控股子公司MEMS-IMU通过验证并启动试产的公告 | 2023-12-29 | Chinese | |
| 关于召开2024年第二次临时股东大会的通知 | 2023-12-28 | Chinese | |
| 募集资金管理制度（2023年12月） | 2023-12-28 | Chinese | |
| 独立董事工作制度（2023年12月） | 2023-12-28 | Chinese | |
| 关于青岛聚能创芯微电子有限公司完成工商变更登记的公告 | 2023-12-28 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2024
1 filing
| |||||
| 37282867 | 2024年第一次临时股东大会决议公告 | 2024-01-03 | Chinese | ||
|
2023
14 filings
| |||||
| 37282861 | 关于控股子公司MEMS-IMU通过验证并启动试产的公告 | 2023-12-29 | Chinese | ||
| 37282853 | 关于召开2024年第二次临时股东大会的通知 | 2023-12-28 | Chinese | ||
| 37282849 | 募集资金管理制度（2023年12月） | 2023-12-28 | Chinese | ||
| 37282839 | 独立董事工作制度（2023年12月） | 2023-12-28 | Chinese | ||
| 37282827 | 关于青岛聚能创芯微电子有限公司完成工商变更登记的公告 | 2023-12-28 | Chinese | ||
| 37282817 | 关于修订《公司章程》的公告 | 2023-12-28 | Chinese | ||
| 37282805 | 第五届董事会第四次会议决议公告 | 2023-12-28 | Chinese | ||
| 37282796 | 独立董事专门会议工作细则（2023年12月） | 2023-12-28 | Chinese | ||
| 37282785 | 对外提供财务资助管理制度（2023年12月） | 2023-12-28 | Chinese | ||
| 37282777 | 公司章程（2023年12月） | 2023-12-28 | Chinese | ||
| 37282756 | 提名委员会工作细则（2023年12月） | 2023-12-28 | Chinese | ||
| 37282750 | 股东大会议事规则（2023年12月） | 2023-12-28 | Chinese | ||
| 37282739 | 投资者关系管理制度（2023年12月） | 2023-12-28 | Chinese | ||
| 37282729 | 薪酬与考核委员会工作细则（2023年12月） | 2023-12-28 | Chinese | ||
Market data
Market data not available
Price history
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Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
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