Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 投资者关系管理制度（2023年12月） | 2023-12-28 | Chinese | |
| 薪酬与考核委员会工作细则（2023年12月） | 2023-12-28 | Chinese | |
| 董事、监事、高级管理人员薪酬管理制度（2023年12月） | 2023-12-28 | Chinese | |
| 对外担保管理制度（2023年12月） | 2023-12-28 | Chinese | |
| 董事会议事规则（2023年12月） | 2023-12-28 | Chinese | |
| 战略委员会工作细则（2023年12月） | 2023-12-28 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2023
15 filings
| |||||
| 37282739 | 投资者关系管理制度（2023年12月） | 2023-12-28 | Chinese | ||
| 37282729 | 薪酬与考核委员会工作细则（2023年12月） | 2023-12-28 | Chinese | ||
| 37282716 | 董事、监事、高级管理人员薪酬管理制度（2023年12月） | 2023-12-28 | Chinese | ||
| 37282708 | 对外担保管理制度（2023年12月） | 2023-12-28 | Chinese | ||
| 37282695 | 董事会议事规则（2023年12月） | 2023-12-28 | Chinese | ||
| 37282678 | 战略委员会工作细则（2023年12月） | 2023-12-28 | Chinese | ||
| 37282672 | 关于全资子公司不动产抵押的公告 | 2023-12-28 | Chinese | ||
| 37282663 | 审计委员会工作细则（2023年12月） | 2023-12-28 | Chinese | ||
| 37282653 | 董事会秘书工作制度（2023年12月） | 2023-12-28 | Chinese | ||
| 37282644 | 关于召开2024年第一次临时股东大会的提示性公告 | 2023-12-28 | Chinese | ||
| 37282636 | 外汇衍生品交易业务管理制度（2023年12月） | 2023-12-28 | Chinese | ||
| 37282627 | 关联交易管理制度（2023年12月） | 2023-12-28 | Chinese | ||
| 37282615 | 关于全资子公司MEMS-OCS启动量产的公告 | 2023-12-24 | Chinese | ||
| 37282605 | 关于控股子公司完成工商注册登记的公告 | 2023-12-22 | Chinese | ||
| 37282596 | 关于全资子公司完成工商变更登记的公告 | 2023-12-21 | Chinese | ||
Market data
Market data not available
Price history
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Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
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