Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 2024年第三季度报告披露提示性公告 | 2024-10-28 | Chinese | |
| 关于召开2024年第五次临时股东大会的通知 | 2024-10-28 | Chinese | |
| 关于会计政策变更的公告 | 2024-10-28 | Chinese | |
| 关于2024年前三季度计提资产减值准备的公告 | 2024-10-28 | Chinese | |
| 关于持股5%以上股东减持计划的预披露公告 | 2024-10-16 | Chinese | |
| 关于控股股东进行股票质押式回购交易及解除质押的公告 | 2024-10-15 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2024
15 filings
| |||||
| 37284860 | 2024年第三季度报告披露提示性公告 | 2024-10-28 | Chinese | ||
| 37284852 | 关于召开2024年第五次临时股东大会的通知 | 2024-10-28 | Chinese | ||
| 37284840 | 关于会计政策变更的公告 | 2024-10-28 | Chinese | ||
| 37284833 | 关于2024年前三季度计提资产减值准备的公告 | 2024-10-28 | Chinese | ||
| 37284821 | 关于持股5%以上股东减持计划的预披露公告 | 2024-10-16 | Chinese | ||
| 37284817 | 关于控股股东进行股票质押式回购交易及解除质押的公告 | 2024-10-15 | Chinese | ||
| 37284805 | 关于控股子公司MEMS温湿度传感器通过验证并启动试产的公告 | 2024-10-09 | Chinese | ||
| 37284796 | 关于控股股东进行股票质押式回购交易及解除质押的公告 | 2024-10-08 | Chinese | ||
| 37284785 | 关于控股股东进行股票质押式回购交易及解除质押的公告 | 2024-09-27 | Chinese | ||
| 37284773 | 关于控股股东进行股票质押式回购交易及解除质押的公告 | 2024-09-25 | Chinese | ||
| 37284765 | 关于瑞典子公司发行认股权证完成注册登记的公告 | 2024-08-30 | Chinese | ||
| 37284756 | 2024年半年度报告 | 2024-08-26 | Chinese | ||
| 37284752 | 关于签订募集资金四方监管协议的公告 | 2024-08-26 | Chinese | ||
| 37284742 | 监事会决议公告 | 2024-08-26 | Chinese | ||
| 37284731 | 关于2024年半年度募集资金存放与使用情况的专项报告 | 2024-08-26 | Chinese | ||
Market data
Market data not available
Price history
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Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
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