Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 关于持股5%以上股东减持计划实施完毕的公告 | 2025-02-07 | Chinese | |
| 关于控股股东股票质押式回购交易提前购回的公告 | 2025-01-27 | Chinese | |
| 2024年年度业绩预告 | 2025-01-23 | Chinese | |
| 关于全资子公司不动产解除抵押的公告 | 2025-01-15 | Chinese | |
| 关于控股股东、实际控制人减持计划实施完毕的公告 | 2024-12-31 | Chinese | |
| 关于公司再次通过高新技术企业认定的公告 | 2024-12-23 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2025
4 filings
| |||||
| 37285149 | 关于持股5%以上股东减持计划实施完毕的公告 | 2025-02-07 | Chinese | ||
| 37285144 | 关于控股股东股票质押式回购交易提前购回的公告 | 2025-01-27 | Chinese | ||
| 37285137 | 2024年年度业绩预告 | 2025-01-23 | Chinese | ||
| 37285130 | 关于全资子公司不动产解除抵押的公告 | 2025-01-15 | Chinese | ||
|
2024
11 filings
| |||||
| 37285119 | 关于控股股东、实际控制人减持计划实施完毕的公告 | 2024-12-31 | Chinese | ||
| 37285103 | 关于公司再次通过高新技术企业认定的公告 | 2024-12-23 | Chinese | ||
| 37285094 | 第五届监事会第十一次会议决议公告 | 2024-12-18 | Chinese | ||
| 37285084 | 关于控股股东为全资子公司申请银行并购贷款提供关联担保的公告 | 2024-12-18 | Chinese | ||
| 37285075 | 关于为子公司开展融资租赁业务及申请银行并购贷款提供担保的公告 | 2024-12-18 | Chinese | ||
| 37285064 | 第五届董事会第十二次会议决议公告 | 2024-12-18 | Chinese | ||
| 37285056 | 关于子公司开展融资租赁业务的公告 | 2024-12-18 | Chinese | ||
| 37285045 | 关于全资子公司向银行申请并购贷款的公告 | 2024-12-18 | Chinese | ||
| 37285034 | 关于媒体报道的澄清公告 | 2024-12-06 | Chinese | ||
| 37285033 | 关于持股5%以上股东减持股份比例达到1%的公告 | 2024-12-03 | Chinese | ||
| 37285021 | 关于参与投资深圳智能传感产业基金的公告 | 2024-11-29 | Chinese | ||
Market data
Market data not available
Price history
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Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
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