
Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 2024年度财务决算报告 | 2025-03-19 | Chinese | |
| 2024年度独立董事述职报告(付三中) | 2025-03-19 | Chinese | |
| 2024年度独立董事述职报告(王玮) | 2025-03-19 | Chinese | |
| 关于终止公司向不特定对象发行可转换公司债券的公告 | 2025-03-19 | Chinese | |
| 关于“质量回报双提升”行动方案的进展公告 | 2025-03-19 | Chinese | |
| 关于为子公司申请银行授信提供担保的公告 | 2025-03-19 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2025
15 filings
| |||||
| 37285331 | 2024年度财务决算报告 | 2025-03-19 | Chinese | ||
| 37285328 | 2024年度独立董事述职报告(付三中) | 2025-03-19 | Chinese | ||
| 37285318 | 2024年度独立董事述职报告(王玮) | 2025-03-19 | Chinese | ||
| 37285303 | 关于终止公司向不特定对象发行可转换公司债券的公告 | 2025-03-19 | Chinese | ||
| 37285293 | 关于“质量回报双提升”行动方案的进展公告 | 2025-03-19 | Chinese | ||
| 37285284 | 关于为子公司申请银行授信提供担保的公告 | 2025-03-19 | Chinese | ||
| 37285273 | 内部控制审计报告 | 2025-03-19 | Chinese | ||
| 37285262 | 2024年年度报告 | 2025-03-19 | Chinese | ||
| 37285255 | 2024年年度报告披露提示性公告 | 2025-03-19 | Chinese | ||
| 37285247 | 2025年度董事、监事、高级管理人员薪酬方案 | 2025-03-19 | Chinese | ||
| 37285240 | 关于开展外汇衍生品交易业务的可行性分析报告 | 2025-03-19 | Chinese | ||
| 37285231 | 关于开展外汇衍生品交易业务的公告 | 2025-03-19 | Chinese | ||
| 37285221 | 2024年度监事会工作报告 | 2025-03-19 | Chinese | ||
| 37285211 | 2024年年度审计报告 | 2025-03-19 | Chinese | ||
| 37285159 | 2024年度内部控制自我评价报告 | 2025-03-19 | Chinese | ||
Market data
Market data not available
Price history
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Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
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