
Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 2025年第一季度报告披露提示性公告 | 2025-04-24 | Chinese | |
| 第五届监事会第十三次会议决议公告 | 2025-04-24 | Chinese | |
| 2024年年度股东大会决议公告 | 2025-04-10 | Chinese | |
| 关于高级管理人员变动的公告 | 2025-04-10 | Chinese | |
| 2024年年度股东大会的法律意见书 | 2025-04-10 | Chinese | |
| 第五届董事会第十四次会议决议公告 | 2025-04-10 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2025
15 filings
| |||||
| 37286217 | 2025年第一季度报告披露提示性公告 | 2025-04-24 | Chinese | ||
| 37286211 | 第五届监事会第十三次会议决议公告 | 2025-04-24 | Chinese | ||
| 37286197 | 2024年年度股东大会决议公告 | 2025-04-10 | Chinese | ||
| 37286184 | 关于高级管理人员变动的公告 | 2025-04-10 | Chinese | ||
| 37286172 | 2024年年度股东大会的法律意见书 | 2025-04-10 | Chinese | ||
| 37286151 | 第五届董事会第十四次会议决议公告 | 2025-04-10 | Chinese | ||
| 37286141 | 关于召开2024年年度股东大会的提示性公告 | 2025-04-08 | Chinese | ||
| 37286133 | 2024年度募集资金存放与使用情况鉴证报告 | 2025-03-19 | Chinese | ||
| 37286126 | 关于举行2024年度网上业绩说明会的公告 | 2025-03-19 | Chinese | ||
| 37286117 | 2024年度环境、社会及治理(ESG)报告 | 2025-03-19 | Chinese | ||
| 37285631 | 关于召开2024年年度股东大会的通知 | 2025-03-19 | Chinese | ||
| 37285619 | 关于控股股东为公司及子公司申请银行授信提供关联担保的公告 | 2025-03-19 | Chinese | ||
| 37285610 | 关于2024年度募集资金存放与使用情况的专项报告 | 2025-03-19 | Chinese | ||
| 37285593 | 关于使用部分闲置自有资金进行现金管理的公告 | 2025-03-19 | Chinese | ||
| 37285576 | 关于公司及子公司向银行申请综合授信额度的公告 | 2025-03-19 | Chinese | ||
Market data
Market data not available
Price history
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Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
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