
Honor Device Co. Ltd. — Investor Relations & Filings
Honor Device Co. Ltd. is a global provider of smart devices. Its product portfolio includes smartphones, laptops, tablets, and wearable technology. The company is focused on developing an interconnected ecosystem of AI-powered devices, aiming to revolutionize human-to-device interactions. Through significant investment in artificial intelligence, Honor seeks to create a seamless and intelligent user experience across its entire product range. The company's stated goal is to become an iconic global technology brand.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 深圳欧陆通电子股份有限公司2024年限制性股票激励计划(草案)摘要 | 2024-08-28 | Chinese | |
| 关于副总经理、董事会秘书辞任暨聘任副总经理、董事会秘书的公告 | 2024-08-13 | Chinese | |
| 第三届董事会2024年第四次会议决议公告 | 2024-08-13 | Chinese | |
| 关于签署募集资金三方监管协议的公告 | 2024-08-12 | Chinese | |
| 国金证券股份有限公司关于深圳欧陆通电子股份有限公司向不特定对象发行可转换公司债券并在创业板上市之上市保荐书 | 2024-07-21 | Chinese | |
| 深圳欧陆通电子股份有限公司向不特定对象发行可转换公司债券上市公告书 | 2024-07-21 | Chinese |
Browse filings by year
7 years| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2024
15 filings
| |||||
| 39174580 | 深圳欧陆通电子股份有限公司2024年限制性股票激励计划(草案)摘要 | 2024-08-28 | Chinese | ||
| 39174560 | 关于副总经理、董事会秘书辞任暨聘任副总经理、董事会秘书的公告 | 2024-08-13 | Chinese | ||
| 39174551 | 第三届董事会2024年第四次会议决议公告 | 2024-08-13 | Chinese | ||
| 39174540 | 关于签署募集资金三方监管协议的公告 | 2024-08-12 | Chinese | ||
| 39174530 | 国金证券股份有限公司关于深圳欧陆通电子股份有限公司向不特定对象发行可转换公司债券并在创业板上市之上市保荐书 | 2024-07-21 | Chinese | ||
| 39174501 | 深圳欧陆通电子股份有限公司向不特定对象发行可转换公司债券上市公告书 | 2024-07-21 | Chinese | ||
| 39174467 | 广东信达律师事务所关于深圳欧陆通电子股份有限公司向不特定对象发行可转换公司债券并在深圳证券交易所上市之法律意见书 | 2024-07-21 | Chinese | ||
| 39174419 | 欧陆通向不特定对象发行可转换公司债券发行结果公告 | 2024-07-10 | Chinese | ||
| 39174404 | 欧陆通向不特定对象发行可转换公司债券中签号码公告 | 2024-07-08 | Chinese | ||
| 39174389 | 欧陆通向不特定对象发行可转换公司债券网上发行中签率及优先配售结果公告 | 2024-07-07 | Chinese | ||
| 39174374 | 欧陆通向不特定对象发行可转债发行提示性公告 | 2024-07-04 | Chinese | ||
| 39174358 | 发行保荐书 | 2024-07-02 | Chinese | ||
| 39174344 | 向不特定对象发行可转换公司债券募集说明书提示性公告 | 2024-07-02 | Chinese | ||
| 39174322 | 募集说明书 | 2024-07-02 | Chinese | ||
| 39174242 | 欧陆通向不特定对象发行可转债发行公告 | 2024-07-02 | Chinese | ||
Market data
Market data not available
Price history
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Honor Device Co. Ltd. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/17834/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=17834 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=17834 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=17834 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 17834}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Honor Device Co. Ltd. (id: 17834)"
Report missing filing
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