
TongFu Microelectronics Co.,Ltd. — Investor Relations & Filings
TongFu Microelectronics Co.,Ltd. (TFME) is a global provider of integrated circuit (IC) assembly and testing services, offering a comprehensive suite of solutions including wafer probing, bumping, assembly, and final testing. The company specializes in advanced packaging technologies such as Flip Chip (FC), Wafer Level Chip Scale Packaging (WLCSP), System-in-Package (SiP), and 2.5D/3D integration. Through strategic partnerships and the acquisition of high-performance assembly facilities, TFME has established a strong presence in the computing, communications, automotive, and consumer electronics markets. Its service portfolio addresses critical requirements for miniaturization, high-speed data transmission, and thermal efficiency, supporting the development of next-generation semiconductor applications.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 第七届董事会第二十五次会议决议公告 | 2023-05-30 | Chinese | |
| 关于调整2022年股票期权激励计划行权价格及注销部分股票期权的公告 | 2023-05-30 | Chinese | |
| 第七届监事会第二十二次会议决议公告 | 2023-05-30 | Chinese | |
| 监事会关于2022年股票期权激励计划有关事项的核查意见 | 2023-05-30 | Chinese | |
| 关于变更高级管理人员的公告 | 2023-05-30 | Chinese | |
| 关于2022年股票期权激励计划授予的股票期权第一个行权期行权条件成就的公告 | 2023-05-30 | Chinese |
Browse filings by year
20 years- 2026 67 filings
- 2025 94 filings
- 2024 129 filings
- 2023 99 filings
- 2022 134 filings
- 2021 118 filings
- 2020 137 filings
- 2019 84 filings
- 2018 85 filings
- 2017 138 filings
- 2016 144 filings
- 2015 137 filings
- 2014 106 filings
- 2013 56 filings
- 2012 64 filings
- 2011 68 filings
- 2010 84 filings
- 2009 78 filings
- 2008 88 filings
- 2007 44 filings
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2023
15 filings
| |||||
| 34961156 | 第七届董事会第二十五次会议决议公告 | 2023-05-30 | Chinese | ||
| 34961146 | 关于调整2022年股票期权激励计划行权价格及注销部分股票期权的公告 | 2023-05-30 | Chinese | ||
| 34961130 | 第七届监事会第二十二次会议决议公告 | 2023-05-30 | Chinese | ||
| 34961114 | 监事会关于2022年股票期权激励计划有关事项的核查意见 | 2023-05-30 | Chinese | ||
| 34961105 | 关于变更高级管理人员的公告 | 2023-05-30 | Chinese | ||
| 34961089 | 关于2022年股票期权激励计划授予的股票期权第一个行权期行权条件成就的公告 | 2023-05-30 | Chinese | ||
| 34961075 | 北京大成律师事务所关于通富微电子股份有限公司调整2022年股票期权激励计划行权价格、注销部分股票期权及第一个行权期行权条件成就之法律意见书 | 2023-05-30 | Chinese | ||
| 34961064 | 2022年股票期权激励计划第一个行权期激励对象名单 | 2023-05-30 | Chinese | ||
| 34961053 | 独立董事关于第七届董事会第二十五次会议相关事项的独立意见 | 2023-05-30 | Chinese | ||
| 34961039 | 关于股东股份变动比例超过1%暨减持数量过半的公告 | 2023-05-29 | Chinese | ||
| 34961023 | 2022年年度权益分派实施公告 | 2023-05-23 | Chinese | ||
| 34961014 | 关于第一期员工持股计划预留份额非交易过户完成暨实施进展的公告 | 2023-05-17 | Chinese | ||
| 34961002 | 关于非公开发行股票限售股份上市流通的提示性公告 | 2023-05-09 | Chinese | ||
| 34960991 | 海通证券股份有限公司关于通富微电子股份有限公司非公开发行股票限售股份上市流通之核查意见 | 2023-05-09 | Chinese | ||
| 34960975 | 大股东减持股份预披露公告 | 2023-04-27 | Chinese | ||
Market data
Market data not available
Price history
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TongFu Microelectronics Co.,Ltd. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/54210/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=54210 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=54210 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=54210 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 54210}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for TongFu Microelectronics Co.,Ltd. (id: 54210)"
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