
TongFu Microelectronics Co.,Ltd. — Investor Relations & Filings
TongFu Microelectronics Co.,Ltd. (TFME) is a global provider of integrated circuit (IC) assembly and testing services, offering a comprehensive suite of solutions including wafer probing, bumping, assembly, and final testing. The company specializes in advanced packaging technologies such as Flip Chip (FC), Wafer Level Chip Scale Packaging (WLCSP), System-in-Package (SiP), and 2.5D/3D integration. Through strategic partnerships and the acquisition of high-performance assembly facilities, TFME has established a strong presence in the computing, communications, automotive, and consumer electronics markets. Its service portfolio addresses critical requirements for miniaturization, high-speed data transmission, and thermal efficiency, supporting the development of next-generation semiconductor applications.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 海通证券股份有限公司关于通富微电子股份有限公司参与投资设立产业基金暨关联交易的核查意见 | 2024-01-12 | Chinese | |
| 总裁工作细则 | 2024-01-12 | Chinese | |
| 第七届董事会第二十八次会议决议公告 | 2024-01-12 | Chinese | |
| 关于会计估计变更的公告 | 2024-01-12 | Chinese | |
| 独立董事工作制度 | 2024-01-12 | Chinese | |
| 关于控股股东股份质押的公告 | 2023-12-20 | Chinese |
Browse filings by year
20 years- 2026 67 filings
- 2025 94 filings
- 2024 129 filings
- 2023 99 filings
- 2022 134 filings
- 2021 118 filings
- 2020 137 filings
- 2019 84 filings
- 2018 85 filings
- 2017 138 filings
- 2016 144 filings
- 2015 137 filings
- 2014 106 filings
- 2013 56 filings
- 2012 64 filings
- 2011 68 filings
- 2010 84 filings
- 2009 78 filings
- 2008 88 filings
- 2007 44 filings
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2024
5 filings
| |||||
| 34961735 | 海通证券股份有限公司关于通富微电子股份有限公司参与投资设立产业基金暨关联交易的核查意见 | 2024-01-12 | Chinese | ||
| 34961723 | 总裁工作细则 | 2024-01-12 | Chinese | ||
| 34961715 | 第七届董事会第二十八次会议决议公告 | 2024-01-12 | Chinese | ||
| 34961702 | 关于会计估计变更的公告 | 2024-01-12 | Chinese | ||
| 34961691 | 独立董事工作制度 | 2024-01-12 | Chinese | ||
|
2023
10 filings
| |||||
| 34961684 | 关于控股股东股份质押的公告 | 2023-12-20 | Chinese | ||
| 34961672 | 关于股东股份比例变动1%暨减持计划实施完毕的公告 | 2023-11-15 | Chinese | ||
| 34961659 | 简式权益变动报告书 | 2023-11-07 | Chinese | ||
| 34961643 | 关于披露权益变动报告书的提示性公告 | 2023-11-07 | Chinese | ||
| 34961631 | 关于控股股东部分股份解除质押的公告 | 2023-11-01 | Chinese | ||
| 34961620 | 董事会决议公告 | 2023-10-25 | Chinese | ||
| 34961607 | 海通证券股份有限公司关于通富微电子股份有限公司关于使用闲置募集资金进行现金管理的核查意见 | 2023-10-25 | Chinese | ||
| 34961594 | 2023年三季度报告 | 2023-10-25 | Chinese | ||
| 34961580 | 关于使用闲置募集资金进行现金管理的公告 | 2023-10-25 | Chinese | ||
| 34961561 | 独立董事关于第七届董事会第二十七次会议相关事项的独立意见 | 2023-10-25 | Chinese | ||
Market data
Market data not available
Price history
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TongFu Microelectronics Co.,Ltd. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/54210/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=54210 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=54210 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=54210 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 54210}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
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