
TongFu Microelectronics Co.,Ltd. — Investor Relations & Filings
TongFu Microelectronics Co.,Ltd. (TFME) is a global provider of integrated circuit (IC) assembly and testing services, offering a comprehensive suite of solutions including wafer probing, bumping, assembly, and final testing. The company specializes in advanced packaging technologies such as Flip Chip (FC), Wafer Level Chip Scale Packaging (WLCSP), System-in-Package (SiP), and 2.5D/3D integration. Through strategic partnerships and the acquisition of high-performance assembly facilities, TFME has established a strong presence in the computing, communications, automotive, and consumer electronics markets. Its service portfolio addresses critical requirements for miniaturization, high-speed data transmission, and thermal efficiency, supporting the development of next-generation semiconductor applications.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 监事会决议公告 | 2023-10-25 | Chinese | |
| 2023年半年度报告摘要 | 2023-08-30 | Chinese | |
| 2023年半年度报告 | 2023-08-30 | Chinese | |
| 半年度非经营性资金占用及其他关联资金往来情况汇总表 | 2023-08-30 | Chinese | |
| 2023年半年度财务报告 | 2023-08-30 | Chinese | |
| 2023年1-6月募集资金存放与实际使用情况的专项报告 | 2023-08-30 | Chinese |
Browse filings by year
20 years- 2026 67 filings
- 2025 94 filings
- 2024 129 filings
- 2023 99 filings
- 2022 134 filings
- 2021 118 filings
- 2020 137 filings
- 2019 84 filings
- 2018 85 filings
- 2017 138 filings
- 2016 144 filings
- 2015 137 filings
- 2014 106 filings
- 2013 56 filings
- 2012 64 filings
- 2011 68 filings
- 2010 84 filings
- 2009 78 filings
- 2008 88 filings
- 2007 44 filings
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2023
15 filings
| |||||
| 34961555 | 监事会决议公告 | 2023-10-25 | Chinese | ||
| 34961552 | 2023年半年度报告摘要 | 2023-08-30 | Chinese | ||
| 34961538 | 2023年半年度报告 | 2023-08-30 | Chinese | ||
| 34961382 | 半年度非经营性资金占用及其他关联资金往来情况汇总表 | 2023-08-30 | Chinese | ||
| 34961361 | 2023年半年度财务报告 | 2023-08-30 | Chinese | ||
| 34961282 | 2023年1-6月募集资金存放与实际使用情况的专项报告 | 2023-08-30 | Chinese | ||
| 34961269 | 半年报监事会决议公告 | 2023-08-30 | Chinese | ||
| 34961252 | 半年报董事会决议公告 | 2023-08-30 | Chinese | ||
| 34961238 | 独立董事关于控股股东及其他关联方占用公司资金、公司对外担保情况的专项说明和独立意见 | 2023-08-30 | Chinese | ||
| 34961230 | 关于延期披露2023年半年度报告的提示性公告 | 2023-08-28 | Chinese | ||
| 34961219 | 2023年半年度业绩预告 | 2023-07-14 | Chinese | ||
| 34961207 | 关于2022年股票期权激励计划第一个行权期采用自主行权模式的提示性公告 | 2023-06-25 | Chinese | ||
| 34961195 | 关于第一期员工持股计划第二个锁定期届满的提示性公告 | 2023-06-09 | Chinese | ||
| 34961180 | 关于2022年股票期权激励计划部分股票期权注销完成的公告 | 2023-06-02 | Chinese | ||
| 34961167 | 关于注销募集资金专户的公告 | 2023-06-01 | Chinese | ||
Market data
Market data not available
Price history
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TongFu Microelectronics Co.,Ltd. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/54210/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=54210 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=54210 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=54210 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 54210}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for TongFu Microelectronics Co.,Ltd. (id: 54210)"
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