
TongFu Microelectronics Co.,Ltd. — Investor Relations & Filings
TongFu Microelectronics Co.,Ltd. (TFME) is a global provider of integrated circuit (IC) assembly and testing services, offering a comprehensive suite of solutions including wafer probing, bumping, assembly, and final testing. The company specializes in advanced packaging technologies such as Flip Chip (FC), Wafer Level Chip Scale Packaging (WLCSP), System-in-Package (SiP), and 2.5D/3D integration. Through strategic partnerships and the acquisition of high-performance assembly facilities, TFME has established a strong presence in the computing, communications, automotive, and consumer electronics markets. Its service portfolio addresses critical requirements for miniaturization, high-speed data transmission, and thermal efficiency, supporting the development of next-generation semiconductor applications.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 关于为下属控制企业提供担保的公告 | 2024-01-12 | Chinese | |
| 关联交易管理办法 | 2024-01-12 | Chinese | |
| 海通证券股份有限公司关于通富微电子股份有限公司使用承兑汇票、信用证及自有外汇支付募集资金投资项目所需资金并以募集资金等额置换的核查意见 | 2024-01-12 | Chinese | |
| 风险投资内部控制制度 | 2024-01-12 | Chinese | |
| 股东大会议事规则 | 2024-01-12 | Chinese | |
| 信息披露管理办法 | 2024-01-12 | Chinese |
Browse filings by year
20 years- 2026 67 filings
- 2025 94 filings
- 2024 129 filings
- 2023 99 filings
- 2022 134 filings
- 2021 118 filings
- 2020 137 filings
- 2019 84 filings
- 2018 85 filings
- 2017 138 filings
- 2016 144 filings
- 2015 137 filings
- 2014 106 filings
- 2013 56 filings
- 2012 64 filings
- 2011 68 filings
- 2010 84 filings
- 2009 78 filings
- 2008 88 filings
- 2007 44 filings
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2024
15 filings
| |||||
| 34961920 | 关于为下属控制企业提供担保的公告 | 2024-01-12 | Chinese | ||
| 34961902 | 关联交易管理办法 | 2024-01-12 | Chinese | ||
| 34961891 | 海通证券股份有限公司关于通富微电子股份有限公司使用承兑汇票、信用证及自有外汇支付募集资金投资项目所需资金并以募集资金等额置换的核查意见 | 2024-01-12 | Chinese | ||
| 34961884 | 风险投资内部控制制度 | 2024-01-12 | Chinese | ||
| 34961868 | 股东大会议事规则 | 2024-01-12 | Chinese | ||
| 34961853 | 信息披露管理办法 | 2024-01-12 | Chinese | ||
| 34961831 | 候选人声明与承诺(时龙兴) | 2024-01-12 | Chinese | ||
| 34961825 | 候选人声明与承诺(王建文) | 2024-01-12 | Chinese | ||
| 34961817 | 提名人声明与承诺(王建文) | 2024-01-12 | Chinese | ||
| 34961813 | 经济担保制度 | 2024-01-12 | Chinese | ||
| 34961799 | 公司章程(2024年) | 2024-01-12 | Chinese | ||
| 34961780 | 董事会议事规则 | 2024-01-12 | Chinese | ||
| 34961766 | 募集资金管理办法 | 2024-01-12 | Chinese | ||
| 34961751 | 候选人声明与承诺(沈小燕) | 2024-01-12 | Chinese | ||
| 34961743 | 关于使用承兑汇票、信用证及自有外汇支付募集资金投资项目所需资金并以募集资金等额置换的公告 | 2024-01-12 | Chinese | ||
Market data
Market data not available
Price history
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TongFu Microelectronics Co.,Ltd. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/54210/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=54210 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=54210 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=54210 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 54210}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
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