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TongFu Microelectronics Co.,Ltd. — Investor Relations & Filings

Ticker · 002156 ISIN · CNE1000006C3 LEI · 655600LP4PHNNE8FAX71 Shenzhen Stock Exchange Manufacturing
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Filings indexed 1,963 across all filing types
Latest filing 2026-06-04 Share Issue/Capital Cha…
Country CN China
Listing Shenzhen Stock Exchange 002156

About TongFu Microelectronics Co.,Ltd.

https://www.tfme.com

TongFu Microelectronics Co.,Ltd. (TFME) is a global provider of integrated circuit (IC) assembly and testing services, offering a comprehensive suite of solutions including wafer probing, bumping, assembly, and final testing. The company specializes in advanced packaging technologies such as Flip Chip (FC), Wafer Level Chip Scale Packaging (WLCSP), System-in-Package (SiP), and 2.5D/3D integration. Through strategic partnerships and the acquisition of high-performance assembly facilities, TFME has established a strong presence in the computing, communications, automotive, and consumer electronics markets. Its service portfolio addresses critical requirements for miniaturization, high-speed data transmission, and thermal efficiency, supporting the development of next-generation semiconductor applications.

Recent filings

Filing Released Lang Actions
国泰海通证券股份有限公司关于公司2026年度向特定对象发行A股股票之上市保荐书
Share Issue/Capital Change Classification · 94% confidence The document is the full “上市保荐书” (listing sponsor letter) prepared by Guotai Haitong Securities for TongFu Microelectronics’ 2026 private placement of new A-shares. It contains detailed terms of the share issuance (number of shares, pricing, use of proceeds, lock-up terms, risk factors, regulatory approvals) rather than mere publication notice or a transcript. This is a capital increase/new share issue filing. Under our taxonomy, this best fits Share Issue/Capital Change (SHA).
2026-06-04 Chinese
关于向特定对象发行股票提交募集说明书（注册稿）等申请文件的提示性公告
Share Issue/Capital Change Classification · 92% confidence The document is an announcement by the company regarding the submission and update of the prospectus for a targeted share issuance (向特定对象发行股票募集说明书), indicating a capital change event. It is not the full prospectus itself but a notification of the share issue application process. This fits the ‘Share Issue/Capital Change’ category (Code: SHA).
2026-06-04 Chinese
国泰海通证券股份有限公司关于公司2026年度向特定对象发行A股股票之发行保荐书
Share Issue/Capital Change Classification · 85% confidence The document is a sponsor’s letter (发行保荐书) from Guotai Haitong Securities concerning TongFu Microelectronics Co., Ltd.’s 2026 private placement issuance of A-shares. It contains detailed terms, underwriting commitments, and financial data specifically for the share issuance. This is not a full annual or interim report, nor a simple publication notice, but a regulatory filing directly tied to a capital-raising share issuance. It therefore falls under the Share Issue/Capital Change category (SHA).
2026-06-04 Chinese
通富微电子股份有限公司2026年度向特定对象发行A股股票募集说明书（注册稿）
Share Issue/Capital Change Classification · 90% confidence The document is the full “募集说明书” (offering prospectus) for Tongfu Microelectronics Co., Ltd.’s targeted A-share issuance in 2026. It contains detailed terms, pricing, share quantities, use of proceeds, risk factors, board approvals, and issuer statements—i.e., a formal equity issuance document. This falls squarely under “Share Issue/Capital Change” (SHA) rather than an earnings release, management discussion, or proxy statement.
2026-06-04 Chinese
关于收到《关于通富微电子股份有限公司申请向特定对象发行股票的审核中心意见告知函》 的公告
Share Issue/Capital Change Classification · 90% confidence The document is an official company announcement regarding the review opinion from the Shenzhen Stock Exchange on the company’s application to issue new shares to specific investors. This concerns a planned share issuance and changes in capital structure. It is not a full financial report, Q&A transcript, or AGM material, but an update on capital issuance. According to definitions, this falls under “Share Issue/Capital Change” (SHA).
2026-06-03 Chinese
通富微电子股份有限公司2026年度向特定对象发行A股股票募集说明书（修订稿）
Share Issue/Capital Change Classification · 92% confidence The document is a detailed募集说明书 (prospectus) for a directed A-share issuance in 2026 by Tongfu Microelectronics. It constitutes a full offering document for a new share issue (private placement), describing offer terms, risk factors, and use of proceeds. This aligns with the “Share Issue/Capital Change” category rather than a simple regulatory filing or annual report. Thus, we classify it as a share issuance announcement/capital change.
2026-06-01 Chinese

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