
TongFu Microelectronics Co.,Ltd. — Investor Relations & Filings
TongFu Microelectronics Co.,Ltd. (TFME) is a global provider of integrated circuit (IC) assembly and testing services, offering a comprehensive suite of solutions including wafer probing, bumping, assembly, and final testing. The company specializes in advanced packaging technologies such as Flip Chip (FC), Wafer Level Chip Scale Packaging (WLCSP), System-in-Package (SiP), and 2.5D/3D integration. Through strategic partnerships and the acquisition of high-performance assembly facilities, TFME has established a strong presence in the computing, communications, automotive, and consumer electronics markets. Its service portfolio addresses critical requirements for miniaturization, high-speed data transmission, and thermal efficiency, supporting the development of next-generation semiconductor applications.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 国泰海通证券股份有限公司关于公司2026年度向特定对象发行A股股票之上市保荐书 | 2026-03-31 | Chinese | |
| 通富微电子股份有限公司与国泰海通证券股份有限公司关于通富微电子股份有限公司申请向特定对象发行股票的审核问询函的回复 | 2026-03-31 | Chinese | |
| 关于申请向特定对象发行股票的审核问询函的回复及募集说明书等申请文件更新的提示性公告 | 2026-03-31 | Chinese | |
| 北京大成律师事务所关于公司2026 年度向特定对象发行A股股票并上市之补充法律意见书(一) | 2026-03-31 | Chinese | |
| 国泰海通证券股份有限公司关于公司2026年度向特定对象发行A股股票之发行保荐书 | 2026-03-31 | Chinese | |
| 关于通富微电子股份有限公司向特定对象发行股票的审核问询函中有关财务会计问题的专项说明 | 2026-03-31 | Chinese |
Browse filings by year
20 years- 2026 67 filings
- 2025 94 filings
- 2024 129 filings
- 2023 99 filings
- 2022 134 filings
- 2021 118 filings
- 2020 137 filings
- 2019 84 filings
- 2018 85 filings
- 2017 138 filings
- 2016 144 filings
- 2015 137 filings
- 2014 106 filings
- 2013 56 filings
- 2012 64 filings
- 2011 68 filings
- 2010 84 filings
- 2009 78 filings
- 2008 88 filings
- 2007 44 filings
Market data
Market data not available
Price history
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ACES
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ACTIONS TECHNOLOGY CO., LTD.
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TongFu Microelectronics Co.,Ltd. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/54210/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=54210 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=54210 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=54210 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 54210}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for TongFu Microelectronics Co.,Ltd. (id: 54210)"
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