Skip to main content
TongFu Microelectronics Co.,Ltd. logo

TongFu Microelectronics Co.,Ltd. — Investor Relations & Filings

Ticker · 002156 ISIN · CNE1000006C3 LEI · 655600LP4PHNNE8FAX71 Shenzhen Stock Exchange Manufacturing
Open in API
Filings indexed 1,953 across all filing types
Latest filing 2026-04-16 Capital/Financing Update
Country CN China
Listing Shenzhen Stock Exchange 002156

About TongFu Microelectronics Co.,Ltd.

https://www.tfme.com

TongFu Microelectronics Co.,Ltd. (TFME) is a global provider of integrated circuit (IC) assembly and testing services, offering a comprehensive suite of solutions including wafer probing, bumping, assembly, and final testing. The company specializes in advanced packaging technologies such as Flip Chip (FC), Wafer Level Chip Scale Packaging (WLCSP), System-in-Package (SiP), and 2.5D/3D integration. Through strategic partnerships and the acquisition of high-performance assembly facilities, TFME has established a strong presence in the computing, communications, automotive, and consumer electronics markets. Its service portfolio addresses critical requirements for miniaturization, high-speed data transmission, and thermal efficiency, supporting the development of next-generation semiconductor applications.

Recent filings

Filing Released Lang Actions
关于为下属控制企业提供担保的公告
Capital/Financing Update Classification · 85% confidence The document is an announcement by a listed company detailing proposed guarantee limits for its subsidiaries, including amounts (RMB63bn), asset ratios, board approval and pending shareholder meeting authorization. This is not a full financial report, board-management change, dividend or share issuance notice; it is a financing-related guarantee update. This falls under “Capital/Financing Update” (CAP).
2026-04-16 Chinese
2025年度利润分配预案的公告
Notice of Dividend Amount Classification · 92% confidence The document is an official profit distribution proposal by the board, specifying cash dividend per share (0.81 yuan per 10 shares), total dividend amount, applicable shares, payment plan, and references to regulatory guidelines for cash dividends. This is a direct announcement of dividend amounts and distribution details to shareholders, fitting the definition of “Notice of Dividend Amount” (DIV).
2026-04-16 Chinese
董事会对会计师事务所 2025年度履职情况评估及审计委员会履行监督职责情况的报告
Governance Information Classification · 85% confidence The document is a formal report from the company’s board and audit committee evaluating the performance of its external auditor and describing the audit committee’s supervision activities. It does not contain the auditor’s standalone audit opinion (so it’s not an AR), nor is it an earnings release, dividend notice, or other financial statement. It focuses on internal governance processes and committee oversight, fitting the Governance Information category (CGR).
2026-04-16 Chinese
2025年年度审计报告
Audit Report / Information Classification · 95% confidence The document is a standalone audit report issued by Grant Thornton (致同) for Tongfu Microelectronics Co., Ltd., containing the auditor’s opinion, basis of opinion, key audit matters, auditor responsibilities, and complete financial statements and notes. It is not the company’s full annual report nor an announcement but the independent auditor’s report itself. This matches the definition of ‘Audit Report / Information’ (AR).
2026-04-16 Chinese
关于2026年度向特定对象发行A股股票摊薄即期回报与填补措施及相关主体承诺（修订稿）的公告
Share Issue/Capital Change Classification · 95% confidence The document is an official announcement by 通富微电子股份有限公司 regarding a specific private placement of A-shares, detailing the number of shares to be issued, impact on key financial metrics (dilution), compensatory measures, and commitments by management and controlling shareholders. This is a corporate action concerning a new share issuance and capital structure change, matching the definition of Share Issue/Capital Change (SHA).
2026-04-09 Chinese
2026年度向特定对象发行A股股票募集资金使用的可行性分析报告（修订稿）
Capital/Financing Update Classification · 92% confidence The document is a detailed feasibility analysis report for the use of proceeds from a specific-target A-share issuance in 2026 by 通富微电子 (Tongfu Microelectronics). It outlines the total fundraising amount, planned projects, and repayment of bank loans—i.e., it is centered on a capital-raising exercise and the intended use of those funds. This falls squarely under “Capital/Financing Update (CAP)” as it describes a financing activity and capital structure change. It is not merely an announcement of publication or an annual/quarterly report but a substantive financing document.
2026-04-09 Chinese

Browse filings by year

20 years

Report missing filing

Can't find a specific document? Let us know and we'll add it within 24 hours.

We will notify you once the filing is added.
Report sent
Thank you. We will check the data and update it shortly.