
Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 关于2019年度计提资产减值准备的公告 | 2020-04-22 | Chinese | |
| 2020年度董事、监事、高级管理人员薪酬方案 | 2020-04-22 | Chinese | |
| 2019年度内部控制自我评价报告 | 2020-04-22 | Chinese | |
| 独立董事2019年度述职报告(景贵飞) | 2020-04-22 | Chinese | |
| 第三届董事会第三十七次会议决议公告 | 2020-04-22 | Chinese | |
| 2019年年度审计报告 | 2020-04-22 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2020
15 filings
| |||||
| 37271188 | 关于2019年度计提资产减值准备的公告 | 2020-04-22 | Chinese | ||
| 37271176 | 2020年度董事、监事、高级管理人员薪酬方案 | 2020-04-22 | Chinese | ||
| 37271167 | 2019年度内部控制自我评价报告 | 2020-04-22 | Chinese | ||
| 37271158 | 独立董事2019年度述职报告(景贵飞) | 2020-04-22 | Chinese | ||
| 37271147 | 第三届董事会第三十七次会议决议公告 | 2020-04-22 | Chinese | ||
| 37271136 | 2019年年度审计报告 | 2020-04-22 | Chinese | ||
| 37271023 | 国信证券股份有限公司关于公司调整募投项目实施进度的核查意见 | 2020-04-22 | Chinese | ||
| 37271010 | 国信证券股份有限公司关于公司2019年度内部控制自我评价报告的核查意见 | 2020-04-22 | Chinese | ||
| 37271003 | 国信证券股份有限公司关于公司2019年度持续督导跟踪报告 | 2020-04-22 | Chinese | ||
| 37270993 | 2019年度财务决算报告 | 2020-04-22 | Chinese | ||
| 37270981 | 关于控股股东及其配偶为公司申请银行授信提供关联担保的公告 | 2020-04-22 | Chinese | ||
| 37270975 | 公司章程(2020年4月) | 2020-04-22 | Chinese | ||
| 37270965 | 独立董事2019年度述职报告(杜杰) | 2020-04-22 | Chinese | ||
| 37270953 | 第三届监事会第二十七次会议决议公告 | 2020-04-22 | Chinese | ||
| 37270948 | 关于公司2019年度控股股东及其他关联方资金占用情况的专项说明 | 2020-04-22 | Chinese | ||
Market data
Market data not available
Price history
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Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
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