
Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 2020年第一季度报告披露提示性公告 | 2020-04-26 | Chinese | |
| 2019年年度报告(更新后) | 2020-04-26 | Chinese | |
| 关于全资子公司对外投资设立全资子公司的公告 | 2020-04-26 | Chinese | |
| 第三届监事会第二十八次会议决议公告 | 2020-04-26 | Chinese | |
| 关于2019年年度报告的更正公告 | 2020-04-26 | Chinese | |
| 2020年第一季度报告全文 | 2020-04-26 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2020
15 filings
| |||||
| 37271836 | 2020年第一季度报告披露提示性公告 | 2020-04-26 | Chinese | ||
| 37271823 | 2019年年度报告(更新后) | 2020-04-26 | Chinese | ||
| 37271648 | 关于全资子公司对外投资设立全资子公司的公告 | 2020-04-26 | Chinese | ||
| 37271636 | 第三届监事会第二十八次会议决议公告 | 2020-04-26 | Chinese | ||
| 37271625 | 关于2019年年度报告的更正公告 | 2020-04-26 | Chinese | ||
| 37271616 | 2020年第一季度报告全文 | 2020-04-26 | Chinese | ||
| 37271577 | 第三届董事会第三十八次会议决议公告 | 2020-04-26 | Chinese | ||
| 37271570 | 关于全资子公司完成工商注册登记的公告 | 2020-04-23 | Chinese | ||
| 37271565 | 关于召开2020年第一次临时股东大会的提示性公告 | 2020-04-23 | Chinese | ||
| 37271543 | 2019年年度报告(已取消) | 2020-04-22 | Chinese | ||
| 37271261 | 内部控制鉴证报告 | 2020-04-22 | Chinese | ||
| 37271244 | 2019年度董事会工作报告 | 2020-04-22 | Chinese | ||
| 37271217 | 关于召开2019年年度股东大会的通知 | 2020-04-22 | Chinese | ||
| 37271206 | 关于聘任2020年度审计机构的公告 | 2020-04-22 | Chinese | ||
| 37271196 | 关于举行2019年度网上业绩说明会的公告 | 2020-04-22 | Chinese | ||
Market data
Market data not available
Price history
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Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
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