
Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 2020年度向特定对象发行股票发行情况报告书 | 2021-08-26 | Chinese | |
| 关于向特定对象发行股票发行情况报告书披露的提示性公告 | 2021-08-26 | Chinese | |
| 中泰证券股份有限公司关于公司向特定对象发行股票发行过程和认购对象合规性的报告 | 2021-08-26 | Chinese | |
| 2021年半年度报告 | 2021-08-25 | Chinese | |
| 独立董事关于第四届董事会第十五次会议相关事项的独立意见 | 2021-08-25 | Chinese | |
| 关于全资子公司股权结构调整的公告 | 2021-08-25 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2021
15 filings
| |||||
| 37276721 | 2020年度向特定对象发行股票发行情况报告书 | 2021-08-26 | Chinese | ||
| 37276708 | 关于向特定对象发行股票发行情况报告书披露的提示性公告 | 2021-08-26 | Chinese | ||
| 37276701 | 中泰证券股份有限公司关于公司向特定对象发行股票发行过程和认购对象合规性的报告 | 2021-08-26 | Chinese | ||
| 37276692 | 2021年半年度报告 | 2021-08-25 | Chinese | ||
| 37276634 | 独立董事关于第四届董事会第十五次会议相关事项的独立意见 | 2021-08-25 | Chinese | ||
| 37276623 | 关于全资子公司股权结构调整的公告 | 2021-08-25 | Chinese | ||
| 37276614 | 关于2021年半年度募集资金存放与使用情况的专项报告 | 2021-08-25 | Chinese | ||
| 37276608 | 监事会决议公告 | 2021-08-25 | Chinese | ||
| 37276600 | 2021年半年度报告摘要 | 2021-08-25 | Chinese | ||
| 37276588 | 2021年半年度报告披露提示性公告 | 2021-08-25 | Chinese | ||
| 37276580 | 董事会决议公告 | 2021-08-25 | Chinese | ||
| 37276577 | 2021年第一次临时股东大会决议公告 | 2021-08-25 | Chinese | ||
| 37276569 | 2021年第一次临时股东大会的法律意见书 | 2021-08-25 | Chinese | ||
| 37276560 | 关于召开2021年第一次临时股东大会的提示性公告 | 2021-08-20 | Chinese | ||
| 37276553 | 关于参股子公司完成工商变更登记的公告 | 2021-08-18 | Chinese | ||
Market data
Market data not available
Price history
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Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
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