
Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 关于控股子公司签署《战略合作框架协议》的公告 | 2021-08-13 | Chinese | |
| 关于董事辞职及补选董事的公告 | 2021-08-09 | Chinese | |
| 第四届董事会第十四次会议决议公告 | 2021-08-09 | Chinese | |
| 关于召开2021年第一次临时股东大会的通知 | 2021-08-09 | Chinese | |
| 关于控股子公司为参股子公司代理采购暨关联交易的公告 | 2021-08-09 | Chinese | |
| 独立董事关于第四届董事会第十四次会议相关事项的独立意见 | 2021-08-09 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2021
15 filings
| |||||
| 37276546 | 关于控股子公司签署《战略合作框架协议》的公告 | 2021-08-13 | Chinese | ||
| 37276537 | 关于董事辞职及补选董事的公告 | 2021-08-09 | Chinese | ||
| 37276528 | 第四届董事会第十四次会议决议公告 | 2021-08-09 | Chinese | ||
| 37276522 | 关于召开2021年第一次临时股东大会的通知 | 2021-08-09 | Chinese | ||
| 37276513 | 关于控股子公司为参股子公司代理采购暨关联交易的公告 | 2021-08-09 | Chinese | ||
| 37276498 | 独立董事关于第四届董事会第十四次会议相关事项的独立意见 | 2021-08-09 | Chinese | ||
| 37276489 | 中泰证券股份有限公司关于公司控股子公司为参股子公司代理采购暨关联交易的核查意见 | 2021-08-09 | Chinese | ||
| 37276479 | 第四届监事会第十二次会议决议公告 | 2021-08-09 | Chinese | ||
| 37276467 | 关于为控股子公司提供委托贷款的公告 | 2021-08-09 | Chinese | ||
| 37276459 | 独立董事关于第四届董事会第十四次会议相关事项的事前认可意见 | 2021-08-09 | Chinese | ||
| 37276446 | 关于参与投资设立的合伙企业完成工商注册登记的公告 | 2021-07-29 | Chinese | ||
| 37276437 | 2021年半年度业绩预告 | 2021-07-12 | Chinese | ||
| 37276429 | 关于参股子公司完成工商变更登记的公告 | 2021-07-09 | Chinese | ||
| 37276420 | 关于参股子公司向不特定合格投资者公开发行股票并在精选层挂牌申请获得全国中小企业股份转让系统有限责任公司受理的公告 | 2021-07-01 | Chinese | ||
| 37276410 | 关于获得投资收益的公告 | 2021-07-01 | Chinese | ||
Market data
Market data not available
Price history
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Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
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