
Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 关于瑞典子公司存量认股权证剩余部分行权并完成工商变更登记的公告 | 2021-09-22 | Chinese | |
| 关于签订募集资金四方监管协议的公告 | 2021-09-14 | Chinese | |
| 关于参加北京辖区深市上市公司投资者集体接待日的公告 | 2021-09-13 | Chinese | |
| 关于全资子公司完成工商变更登记的公告 | 2021-09-13 | Chinese | |
| 关于向特定对象发行股票上市公告书披露的提示性公告 | 2021-09-03 | Chinese | |
| 2020年度向特定对象发行A股股票之上市公告书 | 2021-09-03 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2021
15 filings
| |||||
| 37276861 | 关于瑞典子公司存量认股权证剩余部分行权并完成工商变更登记的公告 | 2021-09-22 | Chinese | ||
| 37276853 | 关于签订募集资金四方监管协议的公告 | 2021-09-14 | Chinese | ||
| 37276844 | 关于参加北京辖区深市上市公司投资者集体接待日的公告 | 2021-09-13 | Chinese | ||
| 37276839 | 关于全资子公司完成工商变更登记的公告 | 2021-09-13 | Chinese | ||
| 37276835 | 关于向特定对象发行股票上市公告书披露的提示性公告 | 2021-09-03 | Chinese | ||
| 37276828 | 2020年度向特定对象发行A股股票之上市公告书 | 2021-09-03 | Chinese | ||
| 37276818 | 董事、监事和高级管理人员持股情况变动报告 | 2021-09-03 | Chinese | ||
| 37276812 | 中泰证券股份有限公司关于公司2020年度向特定对象发行A股股票之上市保荐书 | 2021-09-03 | Chinese | ||
| 37276793 | 关于签订募集资金三方监管协议的公告 | 2021-09-01 | Chinese | ||
| 37276787 | 关于持股5%以上股东持股比例被动稀释超过1%的公告 | 2021-08-31 | Chinese | ||
| 37276774 | 关于控股股东、实际控制人持股比例被动稀释超过1%的公告 | 2021-08-31 | Chinese | ||
| 37276766 | 关于股东权益变动的提示性公告 | 2021-08-31 | Chinese | ||
| 37276758 | 简式权益变动报告书 | 2021-08-31 | Chinese | ||
| 37276746 | 中泰证券股份有限公司关于公司2021年半年度持续督导跟踪报告 | 2021-08-27 | Chinese | ||
| 37276735 | 北京市金杜律师事务所关于公司向特定对象发行股票发行过程和认购对象合规性的法律意见书 | 2021-08-26 | Chinese | ||
Market data
Market data not available
Price history
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Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
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