
Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 天圆全会计师事务所(特殊普通合伙)关于公司以募集资金置换已投入募集资金投资项目的自筹资金的鉴证报告 | 2021-10-26 | Chinese | |
| 2021年第三季度报告披露提示性公告 | 2021-10-26 | Chinese | |
| 第四届董事会第十七次会议决议公告 | 2021-10-26 | Chinese | |
| 关于以募集资金置换预先已投入募投项目自筹资金的公告 | 2021-10-26 | Chinese | |
| 独立董事关于第四届董事会第十七次会议相关事项的独立意见 | 2021-10-26 | Chinese | |
| 2021年第三季度报告(已取消) | 2021-10-26 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2021
15 filings
| |||||
| 37277022 | 天圆全会计师事务所(特殊普通合伙)关于公司以募集资金置换已投入募集资金投资项目的自筹资金的鉴证报告 | 2021-10-26 | Chinese | ||
| 37277011 | 2021年第三季度报告披露提示性公告 | 2021-10-26 | Chinese | ||
| 37277001 | 第四届董事会第十七次会议决议公告 | 2021-10-26 | Chinese | ||
| 37276994 | 关于以募集资金置换预先已投入募投项目自筹资金的公告 | 2021-10-26 | Chinese | ||
| 37276985 | 独立董事关于第四届董事会第十七次会议相关事项的独立意见 | 2021-10-26 | Chinese | ||
| 37276974 | 2021年第三季度报告(已取消) | 2021-10-26 | Chinese | ||
| 37276954 | 第四届监事会第十四次会议决议公告 | 2021-10-26 | Chinese | ||
| 37276944 | 关于控股股东进行股票质押式回购交易补充质押的公告 | 2021-10-22 | Chinese | ||
| 37276934 | 关于控股股东解除质押及部分股票质押到期的公告 | 2021-10-14 | Chinese | ||
| 37276918 | 2021年前三季度业绩预告 | 2021-10-14 | Chinese | ||
| 37276907 | 关于专项出口许可申请被瑞典战略产品检验局ISP否决的公告 | 2021-10-07 | Chinese | ||
| 37276896 | 第四届董事会第十六次会议决议公告 | 2021-09-30 | Chinese | ||
| 37276889 | 关于签署表决权委托协议的公告 | 2021-09-30 | Chinese | ||
| 37276881 | 关于控股股东进行股票质押式回购交易及部分提前购回的公告 | 2021-09-30 | Chinese | ||
| 37276873 | 关于签订募集资金四方监管协议的公告 | 2021-09-27 | Chinese | ||
Market data
Market data not available
Price history
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Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
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