
Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 第四届监事会第十五次会议决议公告 | 2021-11-10 | Chinese | |
| 2021年限制性股票激励计划(草案)(已取消) | 2021-11-10 | Chinese | |
| 关于召开2021年第二次临时股东大会的通知 | 2021-11-10 | Chinese | |
| 关于变更注册资本并修订《公司章程》的公告 | 2021-11-10 | Chinese | |
| 独立董事公开征集委托投票权报告书 | 2021-11-10 | Chinese | |
| 上市公司股权激励计划自查表 | 2021-11-10 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2021
15 filings
| |||||
| 37277197 | 第四届监事会第十五次会议决议公告 | 2021-11-10 | Chinese | ||
| 37277187 | 2021年限制性股票激励计划(草案)(已取消) | 2021-11-10 | Chinese | ||
| 37277174 | 关于召开2021年第二次临时股东大会的通知 | 2021-11-10 | Chinese | ||
| 37277160 | 关于变更注册资本并修订《公司章程》的公告 | 2021-11-10 | Chinese | ||
| 37277151 | 独立董事公开征集委托投票权报告书 | 2021-11-10 | Chinese | ||
| 37277138 | 上市公司股权激励计划自查表 | 2021-11-10 | Chinese | ||
| 37277128 | 北京市中伦律师事务所关于公司2021年限制性股票激励计划(草案)之法律意见书 | 2021-11-10 | Chinese | ||
| 37277113 | 2021年限制性股票激励计划激励对象名单 | 2021-11-10 | Chinese | ||
| 37277094 | 公司章程(2021年11月) | 2021-11-10 | Chinese | ||
| 37277078 | 第四届董事会第十八次会议决议公告 | 2021-11-10 | Chinese | ||
| 37277067 | 关于参与投资设立的合伙企业完成私募投资基金备案的公告 | 2021-11-04 | Chinese | ||
| 37277060 | 关于控股股东部分股票解除质押的公告 | 2021-11-03 | Chinese | ||
| 37277054 | 关于对外投资的公告 | 2021-10-29 | Chinese | ||
| 37277043 | 关于控股股东、实际控制人减持计划的预披露公告 | 2021-10-26 | Chinese | ||
| 37277032 | 中泰证券股份有限公司关于公司以募集资金置换预先已投入募投项目自筹资金的核查意见 | 2021-10-26 | Chinese | ||
Market data
Market data not available
Price history
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Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
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