NEXCHIP SEMICONDUCTOR CORPORATION — Investor Relations & Filings
Nexchip Semiconductor Corporation is a specialized foundry focused on the research, development, and manufacturing of integrated circuits. The company primarily provides foundry services for display driver ICs (DDIC), CMOS image sensors (CIS), power management ICs (PMIC), and microcontrollers (MCU). Utilizing mature process technologies ranging from 150nm to 55nm, Nexchip serves global clients in the consumer electronics, automotive, and industrial sectors. It is recognized as a leading provider in the display driver market, leveraging advanced manufacturing capabilities to support high-volume production of high-resolution display components. The company emphasizes technological innovation in wafer fabrication and assembly to meet the evolving demands of the global semiconductor supply chain.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 晶合集成关于增加2025年度日常关联交易预计的公告 | 2025-08-28 | Chinese | |
| 晶合集成关于召开2025年第一次临时股东会的通知 | 2025-08-28 | Chinese | |
| 合肥晶合集成电路股份有限公司独立董事工作制度(草案) | 2025-08-28 | Chinese | |
| 合肥晶合集成电路股份有限公司募集资金管理制度 | 2025-08-28 | Chinese | |
| 合肥晶合集成电路股份有限公司股东会议事规则 | 2025-08-28 | Chinese | |
| 晶合集成2025年半年度报告 | 2025-08-28 | Chinese |
Browse filings by year
4 years| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2025
15 filings
| |||||
| 39492160 | 晶合集成关于增加2025年度日常关联交易预计的公告 | 2025-08-28 | Chinese | ||
| 39492153 | 晶合集成关于召开2025年第一次临时股东会的通知 | 2025-08-28 | Chinese | ||
| 39492135 | 合肥晶合集成电路股份有限公司独立董事工作制度(草案) | 2025-08-28 | Chinese | ||
| 39492124 | 合肥晶合集成电路股份有限公司募集资金管理制度 | 2025-08-28 | Chinese | ||
| 39492113 | 合肥晶合集成电路股份有限公司股东会议事规则 | 2025-08-28 | Chinese | ||
| 39492094 | 晶合集成2025年半年度报告 | 2025-08-28 | Chinese | ||
| 39492070 | 晶合集成2025年半年度报告摘要 | 2025-08-28 | Chinese | ||
| 39492057 | 晶合集成第二届董事会提名委员会关于公司独立董事候选人的审核意见 | 2025-08-28 | Chinese | ||
| 39492045 | 合肥晶合集成电路股份有限公司关联(连)交易实施细则(草案) | 2025-08-28 | Chinese | ||
| 39492028 | 合肥晶合集成电路股份有限公司对外担保管理制度(草案) | 2025-08-28 | Chinese | ||
| 39492021 | 合肥晶合集成电路股份有限公司董事、高级管理人员所持公司股份及其变动管理制度(草案) | 2025-08-28 | Chinese | ||
| 39492014 | 合肥晶合集成电路股份有限公司内部审计制度 | 2025-08-28 | Chinese | ||
| 39492005 | 合肥晶合集成电路股份有限公司董事、高级管理人员所持公司股份及其变动管理制度 | 2025-08-28 | Chinese | ||
| 39491994 | 中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司增加2025年度日常关联交易预计的核查意见 | 2025-08-28 | Chinese | ||
| 39491982 | 晶合集成第二届董事会独立董事专门会议第七次会议决议 | 2025-08-28 | Chinese | ||
Market data
Market data not available
Price history
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NEXCHIP SEMICONDUCTOR CORPORATION via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/58272/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=58272 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=58272 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=58272 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 58272}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for NEXCHIP SEMICONDUCTOR CORPORATION (id: 58272)"
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