NEXCHIP SEMICONDUCTOR CORPORATION — Investor Relations & Filings
About NEXCHIP SEMICONDUCTOR CORPORATION
Nexchip Semiconductor Corporation is a specialized foundry focused on the research, development, and manufacturing of integrated circuits. The company primarily provides foundry services for display driver ICs (DDIC), CMOS image sensors (CIS), power management ICs (PMIC), and microcontrollers (MCU). Utilizing mature process technologies ranging from 150nm to 55nm, Nexchip serves global clients in the consumer electronics, automotive, and industrial sectors. It is recognized as a leading provider in the display driver market, leveraging advanced manufacturing capabilities to support high-volume production of high-resolution display components. The company emphasizes technological innovation in wafer fabrication and assembly to meet the evolving demands of the global semiconductor supply chain.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 晶合集成2026年第一季度报告 | 2026-04-23 | Chinese | |
| 晶合集成关于使用闲置自有资金进行现金管理的公告 | 2026-04-23 | Chinese | |
| 晶合集成关于参加十五五·科技自立自强——科创板集成电路核心技术攻关之2025年度半导体制造、封测行业集体业绩说明会暨2026年第一季度业绩说明会的公告 | 2026-04-23 | Chinese | |
| 中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司首次公开发行部分限售股上市流通的核查意见 | 2026-04-22 | Chinese | |
| 晶合集成首次公开发行部分限售股上市流通公告 | 2026-04-22 | Chinese | |
| 中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司2025年年度持续督导跟踪报告 | 2026-04-09 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2026
15 filings
| |||||
| 39495774 | 晶合集成2026年第一季度报告 | 2026-04-23 | Chinese | ||
| 39495772 | 晶合集成关于使用闲置自有资金进行现金管理的公告 | 2026-04-23 | Chinese | ||
| 39495766 | 晶合集成关于参加十五五·科技自立自强——科创板集成电路核心技术攻关之2025年度半导体制造、封测行业集体业绩说明会暨2026年第一季度业绩说明会的公告 | 2026-04-23 | Chinese | ||
| 39495759 | 中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司首次公开发行部分限售股上市流通的核查意见 | 2026-04-22 | Chinese | ||
| 39495753 | 晶合集成首次公开发行部分限售股上市流通公告 | 2026-04-22 | Chinese | ||
| 39495744 | 中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司2025年年度持续督导跟踪报告 | 2026-04-09 | Chinese | ||
| 39495743 | 晶合集成关于重新向香港联交所递交H股发行上市的申请并刊发申请资料的公告 | 2026-04-01 | Chinese | ||
| 39495742 | 晶合集成2025年度募集资金存放、管理与实际使用情况的专项报告 | 2026-03-26 | Chinese | ||
| 39495741 | 晶合集成2025年年度报告摘要 | 2026-03-26 | Chinese | ||
| 39495739 | 中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司2025年度募集资金存放、管理与实际使用情况的核查意见 | 2026-03-26 | Chinese | ||
| 39495729 | 晶合集成2025年度独立董事述职报告（陈铤） | 2026-03-26 | Chinese | ||
| 39495721 | 晶合集成2025年度可持续发展报告摘要 | 2026-03-26 | Chinese | ||
| 39495712 | 晶合集成2025年度独立董事述职报告（陈绍亨-已离任） | 2026-03-26 | Chinese | ||
| 39495706 | 晶合集成2025年度独立董事述职报告(安广实） | 2026-03-26 | Chinese | ||
| 39495698 | 晶合集成2025年度可持续发展报告 | 2026-03-26 | Chinese | ||
Market data
Market data not available
Price history
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NEXCHIP SEMICONDUCTOR CORPORATION via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/58272/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=58272 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=58272 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=58272 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 58272}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for NEXCHIP SEMICONDUCTOR CORPORATION (id: 58272)"
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