NEXCHIP SEMICONDUCTOR CORPORATION — Investor Relations & Filings
Nexchip Semiconductor Corporation is a specialized foundry focused on the research, development, and manufacturing of integrated circuits. The company primarily provides foundry services for display driver ICs (DDIC), CMOS image sensors (CIS), power management ICs (PMIC), and microcontrollers (MCU). Utilizing mature process technologies ranging from 150nm to 55nm, Nexchip serves global clients in the consumer electronics, automotive, and industrial sectors. It is recognized as a leading provider in the display driver market, leveraging advanced manufacturing capabilities to support high-volume production of high-resolution display components. The company emphasizes technological innovation in wafer fabrication and assembly to meet the evolving demands of the global semiconductor supply chain.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 晶合集成关于筹划发行H股股票并在香港联合交易所有限公司上市相关事项的提示性公告 | 2025-08-28 | Chinese | |
| 合肥晶合集成电路股份有限公司内部审计制度(草案) | 2025-08-28 | Chinese | |
| 合肥晶合集成电路股份有限公司募集资金管理制度(草案) | 2025-08-28 | Chinese | |
| 合肥晶合集成电路股份有限公司股东会议事规则(草案) | 2025-08-28 | Chinese | |
| 合肥晶合集成电路股份有限公司对外投资管理制度 | 2025-08-28 | Chinese | |
| 合肥晶合集成电路股份有限公司董事会议事规则 | 2025-08-28 | Chinese |
Browse filings by year
4 years| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2025
15 filings
| |||||
| 39491973 | 晶合集成关于筹划发行H股股票并在香港联合交易所有限公司上市相关事项的提示性公告 | 2025-08-28 | Chinese | ||
| 39491959 | 合肥晶合集成电路股份有限公司内部审计制度(草案) | 2025-08-28 | Chinese | ||
| 39491948 | 合肥晶合集成电路股份有限公司募集资金管理制度(草案) | 2025-08-28 | Chinese | ||
| 39491938 | 合肥晶合集成电路股份有限公司股东会议事规则(草案) | 2025-08-28 | Chinese | ||
| 39491925 | 合肥晶合集成电路股份有限公司对外投资管理制度 | 2025-08-28 | Chinese | ||
| 39491913 | 合肥晶合集成电路股份有限公司董事会议事规则 | 2025-08-28 | Chinese | ||
| 39491899 | 晶合集成第二届董事会第二十五次会议决议公告 | 2025-08-28 | Chinese | ||
| 39491887 | 晶合集成关于2025年半年度计提资产减值准备的公告 | 2025-08-28 | Chinese | ||
| 39491876 | 合肥晶合集成电路股份有限公司信息披露管理制度(草案) | 2025-08-28 | Chinese | ||
| 39491868 | 合肥晶合集成电路股份有限公司章程(草案) | 2025-08-28 | Chinese | ||
| 39491844 | 晶合集成独立董事候选人声明与承诺(陈铤) | 2025-08-28 | Chinese | ||
| 39491811 | 晶合集成关于筹划公司在香港联合交易所有限公司上市的提示性公告 | 2025-08-01 | Chinese | ||
| 39491805 | 简式权益变动报告书(力晶创投) | 2025-07-29 | Chinese | ||
| 39491796 | 简式权益变动报告书(华勤技术) | 2025-07-29 | Chinese | ||
| 39491785 | 晶合集成关于持股5%以上股东拟协议转让公司股份暨股东权益变动的提示性公告 | 2025-07-29 | Chinese | ||
Market data
Market data not available
Price history
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NEXCHIP SEMICONDUCTOR CORPORATION via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/58272/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=58272 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=58272 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=58272 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 58272}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for NEXCHIP SEMICONDUCTOR CORPORATION (id: 58272)"
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