NEXCHIP SEMICONDUCTOR CORPORATION — Investor Relations & Filings
Nexchip Semiconductor Corporation is a specialized foundry focused on the research, development, and manufacturing of integrated circuits. The company primarily provides foundry services for display driver ICs (DDIC), CMOS image sensors (CIS), power management ICs (PMIC), and microcontrollers (MCU). Utilizing mature process technologies ranging from 150nm to 55nm, Nexchip serves global clients in the consumer electronics, automotive, and industrial sectors. It is recognized as a leading provider in the display driver market, leveraging advanced manufacturing capabilities to support high-volume production of high-resolution display components. The company emphasizes technological innovation in wafer fabrication and assembly to meet the evolving demands of the global semiconductor supply chain.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 合肥晶合集成电路股份有限公司独立董事工作制度 | 2025-08-28 | Chinese | |
| 合肥晶合集成电路股份有限公司章程 | 2025-08-28 | Chinese | |
| 晶合集成关于取消监事会、变更经营范围、修订《公司章程》及修订、制定部分治理制度的公告 | 2025-08-28 | Chinese | |
| 晶合集成关于续聘会计师事务所的公告 | 2025-08-28 | Chinese | |
| 晶合集成2025年半年度募集资金存放与实际使用情况的专项报告 | 2025-08-28 | Chinese | |
| 晶合集成第二届监事会第十五次会议决议公告 | 2025-08-28 | Chinese |
Browse filings by year
4 years| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2025
15 filings
| |||||
| 39492312 | 合肥晶合集成电路股份有限公司独立董事工作制度 | 2025-08-28 | Chinese | ||
| 39492303 | 合肥晶合集成电路股份有限公司章程 | 2025-08-28 | Chinese | ||
| 39492292 | 晶合集成关于取消监事会、变更经营范围、修订《公司章程》及修订、制定部分治理制度的公告 | 2025-08-28 | Chinese | ||
| 39492286 | 晶合集成关于续聘会计师事务所的公告 | 2025-08-28 | Chinese | ||
| 39492280 | 晶合集成2025年半年度募集资金存放与实际使用情况的专项报告 | 2025-08-28 | Chinese | ||
| 39492271 | 晶合集成第二届监事会第十五次会议决议公告 | 2025-08-28 | Chinese | ||
| 39492265 | 晶合集成2025年度提质增效重回报专项行动方案的半年度评估报告 | 2025-08-28 | Chinese | ||
| 39492258 | 晶合集成关于补选董事及独立董事、调整董事会专门委员会名称及组成的公告 | 2025-08-28 | Chinese | ||
| 39492246 | 合肥晶合集成电路股份有限公司会计师事务所选聘制度(草案) | 2025-08-28 | Chinese | ||
| 39492238 | 合肥晶合集成电路股份有限公司董事会议事规则(草案) | 2025-08-28 | Chinese | ||
| 39492231 | 晶合集成关于修订H股发行并上市后适用的《公司章程(草案)》及制定、修订相关内部治理制度的公告 | 2025-08-28 | Chinese | ||
| 39492219 | 晶合集成独立董事提名人声明与承诺(陈铤) | 2025-08-28 | Chinese | ||
| 39492185 | 晶合集成关于聘请H股发行并上市审计机构的公告 | 2025-08-28 | Chinese | ||
| 39492178 | 合肥晶合集成电路股份有限公司关联交易实施细则 | 2025-08-28 | Chinese | ||
| 39492169 | 合肥晶合集成电路股份有限公司对外担保管理制度 | 2025-08-28 | Chinese | ||
Market data
Market data not available
Price history
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NEXCHIP SEMICONDUCTOR CORPORATION via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/58272/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=58272 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=58272 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=58272 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 58272}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for NEXCHIP SEMICONDUCTOR CORPORATION (id: 58272)"
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