NEXCHIP SEMICONDUCTOR CORPORATION — Investor Relations & Filings
Nexchip Semiconductor Corporation is a specialized foundry focused on the research, development, and manufacturing of integrated circuits. The company primarily provides foundry services for display driver ICs (DDIC), CMOS image sensors (CIS), power management ICs (PMIC), and microcontrollers (MCU). Utilizing mature process technologies ranging from 150nm to 55nm, Nexchip serves global clients in the consumer electronics, automotive, and industrial sectors. It is recognized as a leading provider in the display driver market, leveraging advanced manufacturing capabilities to support high-volume production of high-resolution display components. The company emphasizes technological innovation in wafer fabrication and assembly to meet the evolving demands of the global semiconductor supply chain.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 合肥皖芯集成电路有限公司拟增资扩股涉及的合肥皖芯集成电路有限公司股东全部权益价值项目资产评估报告 | 2025-10-16 | Chinese | |
| 晶合集成关于召开2025年第二次临时股东会的通知 | 2025-10-16 | Chinese | |
| 晶合集成关于控股子公司增资扩股及公司放弃优先认购权暨关联交易的公告 | 2025-10-16 | Chinese | |
| 合肥皖芯集成电路有限公司审计报告 | 2025-10-16 | Chinese | |
| 晶合集成关于向香港联交所递交H股发行上市的申请并刊发申请资料的公告 | 2025-09-29 | Chinese | |
| 晶合集成关于股票交易异常波动的公告 | 2025-09-26 | Chinese |
Browse filings by year
4 years| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2025
15 filings
| |||||
| 39493945 | 合肥皖芯集成电路有限公司拟增资扩股涉及的合肥皖芯集成电路有限公司股东全部权益价值项目资产评估报告 | 2025-10-16 | Chinese | ||
| 39493897 | 晶合集成关于召开2025年第二次临时股东会的通知 | 2025-10-16 | Chinese | ||
| 39493881 | 晶合集成关于控股子公司增资扩股及公司放弃优先认购权暨关联交易的公告 | 2025-10-16 | Chinese | ||
| 39493851 | 合肥皖芯集成电路有限公司审计报告 | 2025-10-16 | Chinese | ||
| 39492454 | 晶合集成关于向香港联交所递交H股发行上市的申请并刊发申请资料的公告 | 2025-09-29 | Chinese | ||
| 39492437 | 晶合集成关于股票交易异常波动的公告 | 2025-09-26 | Chinese | ||
| 39492420 | 晶合集成关于非独立董事辞职暨选举职工代表董事的公告 | 2025-09-16 | Chinese | ||
| 39492408 | 晶合集成2025年第一次临时股东会决议公告 | 2025-09-16 | Chinese | ||
| 39492396 | 北京市金杜律师事务所上海分所关于合肥晶合集成电路股份有限公司2025年第一次临时股东会的法律意见书 | 2025-09-16 | Chinese | ||
| 39492375 | 中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司2025年半年度持续督导跟踪报告 | 2025-09-08 | Chinese | ||
| 39492360 | 晶合集成2025年第一次临时股东会会议资料 | 2025-09-05 | Chinese | ||
| 39492344 | 晶合集成关于参加2025年半年度集体业绩说明会的公告 | 2025-09-02 | Chinese | ||
| 39492332 | 晶合集成关于持股5%以上股东协议转让股份过户完成的公告 | 2025-08-29 | Chinese | ||
| 39492331 | 合肥晶合集成电路股份有限公司信息披露管理制度 | 2025-08-28 | Chinese | ||
| 39492320 | 合肥晶合集成电路股份有限公司会计师事务所选聘制度 | 2025-08-28 | Chinese | ||
Market data
Market data not available
Price history
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NEXCHIP SEMICONDUCTOR CORPORATION via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/58272/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=58272 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=58272 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=58272 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 58272}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for NEXCHIP SEMICONDUCTOR CORPORATION (id: 58272)"
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