SAMCO INC. Logo

SAMCO INC.

Manufactures semiconductor processing equipment for thin-film deposition, etching & surface treatment.

6387 | T

Overview

Corporate Details

ISIN(s):
JP3322950001
LEI:
Country:
Japan
Address:
京都市伏見区竹田藁屋町36番地
Sector:
Manufacturing
Industry:
Manufacture of special-purpose machinery

Description

Samco Inc. is a manufacturer of semiconductor and electronic component processing equipment for both research and development (R&D) and production environments. The company specializes in thin-film deposition, etching, and surface treatment technologies. Its core product lines include systems for Plasma-Enhanced Chemical Vapor Deposition (PECVD), Atomic Layer Deposition (ALD), Inductively Coupled Plasma (ICP) etching, and Deep Reactive Ion Etching (DRIE). Samco also provides surface treatment solutions such as proprietary Aqua Plasma®, plasma, and UV-Ozone cleaners. The company's equipment is used in the fabrication of advanced devices, including MicroLEDs, laser diodes, VCSELs, SiC power devices, GaN RF devices, and BAW/SAW filters.

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Date Filing Language Size Actions
2025-10-20 04:24
Registration Form
確認書
Japanese 8.0 KB
2025-10-20 04:22
Annual Report
有価証券報告書-第46期(2024/08/01-2025/07/31)
Japanese 839.2 KB
2025-03-13 01:15
Report Publication Announcement
確認書
Japanese 8.0 KB
2025-03-13 01:14
Interim Report
半期報告書-第46期(2024/08/01-2025/07/31)
Japanese 193.2 KB
2024-10-24 04:57
Post-Annual General Meeting Information
臨時報告書
Japanese 27.4 KB
2024-10-22 09:43
Regulatory News Service
確認書
Japanese 8.0 KB
2024-10-22 09:41
Regulatory News Service
内部統制報告書-第45期(2023/08/01-2024/07/31)
Japanese 21.4 KB
2024-10-22 09:39
Annual Report
有価証券報告書-第45期(2023/08/01-2024/07/31)
Japanese 825.2 KB
2024-06-10 02:20
Report Publication Announcement
確認書
Japanese 8.0 KB
2024-06-10 02:19
Quarterly Report
四半期報告書-第45期第3四半期(2024/02/01-2024/04/30)
Japanese 155.6 KB
2024-03-14 01:19
Report Publication Announcement
確認書
Japanese 8.0 KB
2024-03-14 01:18
Quarterly Report
四半期報告書-第45期第2四半期(2023/11/01-2024/01/31)
Japanese 190.9 KB
2023-12-12 01:14
Report Publication Announcement
確認書
Japanese 8.0 KB
2023-12-12 01:13
Quarterly Report
四半期報告書-第45期第1四半期(2023/08/01-2023/10/31)
Japanese 153.1 KB
2023-10-26 03:22
Regulatory News Service
臨時報告書
Japanese 21.3 KB

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Insider Transactions

Date Insider Name Position Type Shares Value
No insider transactions recorded for this company.

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