SAMCO INC.
Manufacturer of process equipment for the semiconductor and electronic device industries.
6387 | T
Overview
Corporate Details
- ISIN(s):
- JP3322950001
- LEI:
- Country:
- Japan
- Address:
- 京都市伏見区竹田藁屋町３６番地
- Website:
- https://www.samco.co.jp/en/
- Sector:
- Manufacturing
- Industry:
- Manufacture of special-purpose machinery
Description
SAMCO INC. is a manufacturer of process equipment for the semiconductor and electronic device industries, serving both research and development (R&D) and production applications. The company specializes in thin-film deposition, microfabrication etching, and surface treatment technologies. Its product portfolio includes systems for Atomic Layer Deposition (ALD) and Plasma-Enhanced Chemical Vapor Deposition (PECVD). Etching solutions feature Atomic Layer Etching (ALE), Inductively Coupled Plasma (ICP) etching, and Deep Reactive Ion Etching (DRIE). The company also provides surface treatment equipment, such as plasma cleaning and UV ozone cleaning systems.
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Filings
| Date | Filing | Language | Type / Size | Actions | |
|---|---|---|---|---|---|
| 2021-10-22 07:42 |
確認書
|
Japanese | DOC • 8.2 KB | ||
| 2021-10-22 07:41 |
内部統制報告書－第42期(令和2年8月1日－令和3年7月31日)
|
Japanese | DOC • 21.4 KB | ||
| 2021-10-22 07:39 |
有価証券報告書－第42期(令和2年8月1日－令和3年7月31日)
|
Japanese | DOC • 710.2 KB | ||
| 2021-06-11 02:27 |
四半期報告書－第42期第3四半期(令和3年2月1日－令和3年4月30日)
|
Japanese | DOC • 142.3 KB | ||
| 2021-03-12 01:45 |
四半期報告書－第42期第2四半期(令和2年11月1日－令和3年1月31日)
|
Japanese | DOC • 179.6 KB | ||
| 2020-12-11 02:58 |
四半期報告書－第42期第1四半期(令和2年8月1日－令和2年10月31日)
|
Japanese | DOC • 139.2 KB | ||
| 2020-10-16 07:24 |
内部統制報告書－第41期(令和1年8月1日－令和2年7月31日)
|
Japanese | DOC • 21.5 KB | ||
| 2020-10-16 07:22 |
確認書
|
Japanese | DOC • 8.1 KB | ||
| 2020-10-16 07:21 |
有価証券報告書－第41期(令和1年8月1日－令和2年7月31日)
|
Japanese | DOC • 695.9 KB | ||
| 2020-06-12 02:40 |
四半期報告書－第41期第3四半期(令和2年2月1日－令和2年4月30日)
|
Japanese | DOC • 134.2 KB | ||
| 2020-03-13 01:48 |
四半期報告書－第41期第2四半期(令和1年11月1日－令和2年1月31日)
|
Japanese | DOC • 170.1 KB | ||
| 2019-12-11 05:13 |
四半期報告書－第41期第1四半期(2019/08/01－2019/10/31)
|
Japanese | DOC • 131.7 KB | ||
| 2019-10-18 07:52 |
有価証券報告書－第40期(平成30年8月1日－令和1年7月31日)
|
Japanese | DOC • 692.1 KB | ||
| 2019-06-13 02:24 |
四半期報告書－第40期第3四半期(2019/02/01－2019/04/30)
|
Japanese | DOC • 135.9 KB | ||
| 2019-03-14 01:33 |
四半期報告書－第40期第2四半期(2018/11/01－2019/01/31)
|
Japanese | DOC • 172.4 KB |
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Financials & KPIs
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Insider Transactions
| Date | Insider Name | Position | Type | Shares | Value |
|---|---|---|---|---|---|
| No insider transactions recorded for this company. | |||||
Peer Companies
