SAMCO INC.
Manufacturer of process equipment for the semiconductor and electronic device industries.
6387 | T
Overview
Corporate Details
- ISIN(s):
- JP3322950001
- LEI:
- Country:
- Japan
- Address:
- 京都市伏見区竹田藁屋町３６番地
- Website:
- https://www.samco.co.jp/en/
- Sector:
- Manufacturing
- Industry:
- Manufacture of special-purpose machinery
Description
SAMCO INC. is a manufacturer of process equipment for the semiconductor and electronic device industries, serving both research and development (R&D) and production applications. The company specializes in thin-film deposition, microfabrication etching, and surface treatment technologies. Its product portfolio includes systems for Atomic Layer Deposition (ALD) and Plasma-Enhanced Chemical Vapor Deposition (PECVD). Etching solutions feature Atomic Layer Etching (ALE), Inductively Coupled Plasma (ICP) etching, and Deep Reactive Ion Etching (DRIE). The company also provides surface treatment equipment, such as plasma cleaning and UV ozone cleaning systems.
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Filings
| Date | Filing | Language | Type / Size | Actions | |
|---|---|---|---|---|---|
| 2023-10-24 06:18 |
確認書
|
Japanese | DOC • 8.0 KB | ||
| 2023-10-24 06:17 |
内部統制報告書－第44期(2022/08/01－2023/07/31)
|
Japanese | DOC • 21.4 KB | ||
| 2023-10-24 06:16 |
有価証券報告書－第44期(2022/08/01－2023/07/31)
|
Japanese | DOC • 804.6 KB | ||
| 2023-06-12 02:40 |
確認書
|
Japanese | DOC • 8.0 KB | ||
| 2023-06-12 02:38 |
四半期報告書－第44期第3四半期(2023/02/01－2023/04/30)
|
Japanese | DOC • 154.9 KB | ||
| 2023-03-13 01:03 |
確認書
|
Japanese | DOC • 8.0 KB | ||
| 2023-03-13 01:01 |
四半期報告書－第44期第2四半期(2022/11/01－2023/01/31)
|
Japanese | DOC • 197.0 KB | ||
| 2022-12-12 01:08 |
確認書
|
Japanese | DOC • 8.1 KB | ||
| 2022-12-12 01:07 |
四半期報告書－第44期第1四半期(令和4年8月1日－令和4年10月31日)
|
Japanese | DOC • 152.0 KB | ||
| 2022-10-25 06:25 |
確認書
|
Japanese | DOC • 8.2 KB | ||
| 2022-10-25 06:24 |
内部統制報告書－第43期(令和4年10月25日－令和4年10月25日)
|
Japanese | DOC • 21.5 KB | ||
| 2022-10-25 06:22 |
有価証券報告書－第43期(令和3年8月1日－令和4年7月31日)
|
Japanese | DOC • 774.6 KB | ||
| 2022-06-13 02:19 |
四半期報告書－第43期第3四半期(令和4年2月1日－令和4年4月30日)
|
Japanese | DOC • 156.6 KB | ||
| 2022-03-11 01:16 |
四半期報告書－第43期第2四半期(令和3年11月1日－令和4年1月31日)
|
Japanese | DOC • 196.5 KB | ||
| 2021-12-13 05:31 |
四半期報告書－第43期第1四半期(令和3年8月1日－令和3年10月31日)
|
Japanese | DOC • 154.2 KB |
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Financials & KPIs
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Insider Transactions
| Date | Insider Name | Position | Type | Shares | Value |
|---|---|---|---|---|---|
| No insider transactions recorded for this company. | |||||
Peer Companies
