SAMCO INC.
Manufacturer of process equipment for the semiconductor and electronic device industries.
6387 | T
Overview
Corporate Details
- ISIN(s):
- JP3322950001
- LEI:
- Country:
- Japan
- Address:
- 京都市伏見区竹田藁屋町３６番地
- Website:
- https://www.samco.co.jp/en/
- Sector:
- Manufacturing
- Industry:
- Manufacture of special-purpose machinery
Description
SAMCO INC. is a manufacturer of process equipment for the semiconductor and electronic device industries, serving both research and development (R&D) and production applications. The company specializes in thin-film deposition, microfabrication etching, and surface treatment technologies. Its product portfolio includes systems for Atomic Layer Deposition (ALD) and Plasma-Enhanced Chemical Vapor Deposition (PECVD). Etching solutions feature Atomic Layer Etching (ALE), Inductively Coupled Plasma (ICP) etching, and Deep Reactive Ion Etching (DRIE). The company also provides surface treatment equipment, such as plasma cleaning and UV ozone cleaning systems.
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Filings
| Date | Filing | Language | Type / Size | Actions | |
|---|---|---|---|---|---|
| 2018-12-11 06:31 |
四半期報告書－第40期第1四半期(2018/08/01－2018/10/31)
|
Japanese | ZIP • 134.6 KB | ||
| 2018-10-16 08:03 |
有価証券報告書－第39期(平成29年8月1日－平成30年7月31日)
|
Japanese | ZIP • 637.4 KB | ||
| 2018-06-11 02:50 |
四半期報告書－第39期第3四半期(2018/02/01－2018/04/30)
|
Japanese | ZIP • 131.6 KB | ||
| 2018-03-12 02:50 |
四半期報告書－第39期第2四半期(2017/11/01－2018/01/31)
|
Japanese | ZIP • 164.5 KB | ||
| 2017-12-11 03:44 |
四半期報告書－第39期第1四半期(2017/08/01－2017/10/31)
|
Japanese | ZIP • 130.8 KB | ||
| 2017-10-31 05:23 |
訂正有価証券報告書－第38期(2016/08/01－2017/07/31)
|
Japanese | ZIP • 384.4 KB | ||
| 2017-10-17 08:09 |
有価証券報告書－第38期(2016/08/01－2017/07/31)
|
Japanese | ZIP • 635.5 KB | ||
| 2017-06-12 06:10 |
四半期報告書－第38期第3四半期(2017/02/01－2017/04/30)
|
Japanese | ZIP • 136.2 KB | ||
| 2017-03-13 01:13 |
四半期報告書－第38期第2四半期(2016/11/01－2017/01/31)
|
Japanese | ZIP • 163.6 KB | ||
| 2016-12-12 02:56 |
四半期報告書－第38期第1四半期(2016/08/01－2016/10/31)
|
Japanese | ZIP • 128.3 KB | ||
| 2016-10-21 08:10 |
有価証券報告書－第37期(2015/08/01－2016/07/31)
|
Japanese | ZIP • 636.3 KB | ||
| 2016-06-13 06:51 |
四半期報告書－第37期第3四半期(2016/02/01－2016/04/30)
|
Japanese | ZIP • 136.3 KB | ||
| 2016-03-11 05:20 |
四半期報告書－第37期第2四半期(2015/11/01－2016/01/31)
|
Japanese | ZIP • 162.0 KB | ||
| 2015-12-11 05:07 |
四半期報告書－第37期第1四半期(2015/08/01－2015/10/31)
|
Japanese | ZIP • 129.4 KB | ||
| 2015-10-23 08:23 |
有価証券報告書－第36期(2014/08/01－2015/07/31)
|
Japanese | ZIP • 627.3 KB |
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Market Data
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Financials & KPIs
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Insider Transactions
| Date | Insider Name | Position | Type | Shares | Value |
|---|---|---|---|---|---|
| No insider transactions recorded for this company. | |||||
Peer Companies
