
Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 第四届监事会第二次会议决议公告 | 2020-09-28 | Chinese | |
| 关于全资子公司对外投资的公告 | 2020-09-28 | Chinese | |
| 关于控股子公司8英寸MEMS国际代工线(一期)投产的公告 | 2020-09-27 | Chinese | |
| 关于全资子公司瑞典MEMS产线升级扩产完成的公告 | 2020-09-27 | Chinese | |
| 关于召开2020年第三次临时股东大会的提示性公告 | 2020-09-23 | Chinese | |
| 投资者关系管理制度 | 2020-09-11 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2020
15 filings
| |||||
| 37273670 | 第四届监事会第二次会议决议公告 | 2020-09-28 | Chinese | ||
| 37273661 | 关于全资子公司对外投资的公告 | 2020-09-28 | Chinese | ||
| 37273652 | 关于控股子公司8英寸MEMS国际代工线(一期)投产的公告 | 2020-09-27 | Chinese | ||
| 37273640 | 关于全资子公司瑞典MEMS产线升级扩产完成的公告 | 2020-09-27 | Chinese | ||
| 37273630 | 关于召开2020年第三次临时股东大会的提示性公告 | 2020-09-23 | Chinese | ||
| 37273578 | 投资者关系管理制度 | 2020-09-11 | Chinese | ||
| 37273570 | 年报信息披露重大差错责任追究制度 | 2020-09-11 | Chinese | ||
| 37273566 | 对外提供财务资助管理制度 | 2020-09-11 | Chinese | ||
| 37273557 | 董事会秘书工作制度 | 2020-09-11 | Chinese | ||
| 37273546 | 信息披露管理制度 | 2020-09-11 | Chinese | ||
| 37273529 | 监事会议事规则 | 2020-09-11 | Chinese | ||
| 37273514 | 控股股东、实际控制人、董事和高级管理人员关于向特定对象发行A股股票摊薄即期回报采取填补措施的承诺的公告 | 2020-09-11 | Chinese | ||
| 37273510 | 关于修订《公司章程》的公告 | 2020-09-11 | Chinese | ||
| 37273499 | 2020年度向特定对象发行A股股票募集资金运用可行性分析报告 | 2020-09-11 | Chinese | ||
| 37273482 | 前次募集资金使用情况的鉴证报告 | 2020-09-11 | Chinese | ||
Market data
Market data not available
Price history
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Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
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