
Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 2020年第二次临时股东大会决议公告 | 2020-09-11 | Chinese | |
| 独立董事关于第四届董事会第一次会议相关事项的独立意见 | 2020-09-11 | Chinese | |
| 关于向特定对象发行A股股票摊薄即期回报及填补措施的公告 | 2020-09-11 | Chinese | |
| 股东大会议事规则 | 2020-09-11 | Chinese | |
| 外部信息使用人管理制度 | 2020-09-11 | Chinese | |
| 董事、监事和高级管理人员持有公司股份及其变动管理制度 | 2020-09-11 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2020
15 filings
| |||||
| 37273282 | 2020年第二次临时股东大会决议公告 | 2020-09-11 | Chinese | ||
| 37273268 | 独立董事关于第四届董事会第一次会议相关事项的独立意见 | 2020-09-11 | Chinese | ||
| 37273258 | 关于向特定对象发行A股股票摊薄即期回报及填补措施的公告 | 2020-09-11 | Chinese | ||
| 37273248 | 股东大会议事规则 | 2020-09-11 | Chinese | ||
| 37273232 | 外部信息使用人管理制度 | 2020-09-11 | Chinese | ||
| 37273220 | 董事、监事和高级管理人员持有公司股份及其变动管理制度 | 2020-09-11 | Chinese | ||
| 37273198 | 对外担保管理制度 | 2020-09-11 | Chinese | ||
| 37273188 | 独立董事工作制度 | 2020-09-11 | Chinese | ||
| 37273175 | 关于最近五年未被证券监管部门和交易所处罚或采取监管措施情况的公告 | 2020-09-11 | Chinese | ||
| 37273166 | 关于前次募集资金使用情况的专项报告 | 2020-09-11 | Chinese | ||
| 37273147 | 2020年第二次临时股东大会的法律意见书 | 2020-09-11 | Chinese | ||
| 37273135 | 重大信息内部报告制度 | 2020-09-11 | Chinese | ||
| 37273123 | 内幕信息知情人登记管理制度 | 2020-09-11 | Chinese | ||
| 37273113 | 控股股东和实际控制人行为规范 | 2020-09-11 | Chinese | ||
| 37273100 | 董事会议事规则 | 2020-09-11 | Chinese | ||
Market data
Market data not available
Price history
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Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
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