
Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 未来三年(2021-2023年)股东回报规划 | 2020-09-11 | Chinese | |
| 关于向特定对象发行A股股票预案披露的提示性公告 | 2020-09-11 | Chinese | |
| 第四届董事会第一次会议决议公告 | 2020-09-11 | Chinese | |
| 关于董事兼高级管理人员减持计划提前终止的公告 | 2020-09-11 | Chinese | |
| 关于召开2020年第二次临时股东大会的提示性公告 | 2020-09-08 | Chinese | |
| 关于控股股东股票质押式回购交易提前购回的公告 | 2020-09-02 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2020
15 filings
| |||||
| 37273090 | 未来三年(2021-2023年)股东回报规划 | 2020-09-11 | Chinese | ||
| 37273074 | 关于向特定对象发行A股股票预案披露的提示性公告 | 2020-09-11 | Chinese | ||
| 37273059 | 第四届董事会第一次会议决议公告 | 2020-09-11 | Chinese | ||
| 37273048 | 关于董事兼高级管理人员减持计划提前终止的公告 | 2020-09-11 | Chinese | ||
| 37273036 | 关于召开2020年第二次临时股东大会的提示性公告 | 2020-09-08 | Chinese | ||
| 37273025 | 关于控股股东股票质押式回购交易提前购回的公告 | 2020-09-02 | Chinese | ||
| 37273013 | 关于全资子公司完成工商变更登记的公告 | 2020-08-31 | Chinese | ||
| 37273002 | 独立董事提名人声明 | 2020-08-26 | Chinese | ||
| 37272992 | 独立董事候选人声明 | 2020-08-26 | Chinese | ||
| 37272985 | 关于首次公开发行股票募集资金投资项目结项并将结余募集资金永久补充流动资金的公告 | 2020-08-26 | Chinese | ||
| 37272968 | 独立董事候选人声明 | 2020-08-26 | Chinese | ||
| 37272955 | 第三届监事会第三十一次会议决议公告 | 2020-08-26 | Chinese | ||
| 37272945 | 关于转让全资子公司股权及债权暨关联交易的公告 | 2020-08-26 | Chinese | ||
| 37272933 | 关于召开2020年第二次临时股东大会的通知 | 2020-08-26 | Chinese | ||
| 37272920 | 关于监事会提前换届选举的公告 | 2020-08-26 | Chinese | ||
Market data
Market data not available
Price history
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Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
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