
Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 关于控股子公司注册资本缴足的公告 | 2021-02-10 | Chinese | |
| 关于参股子公司增资暨全资子公司放弃优先认缴出资权的公告 | 2021-02-05 | Chinese | |
| 关于放弃控股子公司股权转让优先购买权暨关联交易的公告 | 2021-02-05 | Chinese | |
| 独立董事关于第四届董事会第九次会议相关事项的独立意见 | 2021-02-05 | Chinese | |
| 中泰证券股份有限公司关于公司放弃控股子公司股权转让优先购买权暨关联交易的核查意见 | 2021-02-05 | Chinese | |
| 第四届监事会第八次会议决议公告 | 2021-02-05 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2021
15 filings
| |||||
| 37274965 | 关于控股子公司注册资本缴足的公告 | 2021-02-10 | Chinese | ||
| 37274956 | 关于参股子公司增资暨全资子公司放弃优先认缴出资权的公告 | 2021-02-05 | Chinese | ||
| 37274935 | 关于放弃控股子公司股权转让优先购买权暨关联交易的公告 | 2021-02-05 | Chinese | ||
| 37274923 | 独立董事关于第四届董事会第九次会议相关事项的独立意见 | 2021-02-05 | Chinese | ||
| 37274915 | 中泰证券股份有限公司关于公司放弃控股子公司股权转让优先购买权暨关联交易的核查意见 | 2021-02-05 | Chinese | ||
| 37274906 | 第四届监事会第八次会议决议公告 | 2021-02-05 | Chinese | ||
| 37274898 | 第四届董事会第九次会议决议公告 | 2021-02-05 | Chinese | ||
| 37274887 | 关于控股股东进行股票质押式回购交易及解除质押的公告 | 2021-02-04 | Chinese | ||
| 37274877 | 关于控股子公司完成工商变更登记的公告 | 2021-02-02 | Chinese | ||
| 37274864 | 关于全资子公司土地及其附着物抵押解除的公告 | 2021-02-02 | Chinese | ||
| 37274855 | 2020年年度业绩预告 | 2021-01-27 | Chinese | ||
| 37274844 | 第四届监事会第七次会议决议公告 | 2021-01-27 | Chinese | ||
| 37274835 | 中泰证券股份有限公司关于公司放弃控股子公司股权转让优先购买权暨关联交易的核查意见 | 2021-01-27 | Chinese | ||
| 37274828 | 独立董事关于第四届董事会第八次会议相关事项的独立意见 | 2021-01-27 | Chinese | ||
| 37274815 | 第四届董事会第八次会议决议公告 | 2021-01-27 | Chinese | ||
Market data
Market data not available
Price history
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Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
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