Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 独立董事工作制度（2022年3月） | 2022-03-30 | Chinese | |
| 监事会议事规则（2022年3月） | 2022-03-30 | Chinese | |
| 关于变更公司电子邮箱的公告 | 2022-03-30 | Chinese | |
| 独立董事关于第四届董事会第二十二次会议相关事项的事前认可意见 | 2022-03-30 | Chinese | |
| 2021年年度报告 | 2022-03-30 | Chinese | |
| 中泰证券股份有限公司关于公司2021年度日常关联交易确认及2022年度日常关联交易预计的核查意见 | 2022-03-30 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2022
15 filings
| |||||
| 37278672 | 独立董事工作制度（2022年3月） | 2022-03-30 | Chinese | ||
| 37278663 | 监事会议事规则（2022年3月） | 2022-03-30 | Chinese | ||
| 37278652 | 关于变更公司电子邮箱的公告 | 2022-03-30 | Chinese | ||
| 37278647 | 独立董事关于第四届董事会第二十二次会议相关事项的事前认可意见 | 2022-03-30 | Chinese | ||
| 37278635 | 2021年年度报告 | 2022-03-30 | Chinese | ||
| 37278632 | 中泰证券股份有限公司关于公司2021年度日常关联交易确认及2022年度日常关联交易预计的核查意见 | 2022-03-30 | Chinese | ||
| 37278619 | 内部信息保密制度（2022年3月） | 2022-03-30 | Chinese | ||
| 37278608 | 外部信息使用人管理制度（2022年3月） | 2022-03-30 | Chinese | ||
| 37278595 | 对外提供财务资助管理制度（2022年3月） | 2022-03-30 | Chinese | ||
| 37278588 | 特定对象来访接待管理制度（2022年3月） | 2022-03-30 | Chinese | ||
| 37278575 | 控股股东、董事、监事和高级管理人员持有公司股份及其变动管理制度（2022年3月） | 2022-03-30 | Chinese | ||
| 37278563 | 重大信息内部报告制度（2022年3月） | 2022-03-30 | Chinese | ||
| 37278531 | 股东大会议事规则（2022年3月） | 2022-03-30 | Chinese | ||
| 37278517 | 公司章程（2022年3月） | 2022-03-30 | Chinese | ||
| 37278507 | 关于前期会计差错更正的公告 | 2022-03-30 | Chinese | ||
Market data
Market data not available
Price history
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Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
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