Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 关于控股股东进行股票质押式回购交易补充质押的公告 | 2022-05-11 | Chinese | |
| 2021年年度权益分派实施公告 | 2022-05-09 | Chinese | |
| 关于全资子公司完成工商变更登记的公告 | 2022-05-05 | Chinese | |
| 2022年一季度报告 | 2022-04-26 | Chinese | |
| 第四届监事会第十九次会议决议公告 | 2022-04-26 | Chinese | |
| 第四届董事会第二十三次会议决议公告 | 2022-04-26 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2022
15 filings
| |||||
| 37279068 | 关于控股股东进行股票质押式回购交易补充质押的公告 | 2022-05-11 | Chinese | ||
| 37279057 | 2021年年度权益分派实施公告 | 2022-05-09 | Chinese | ||
| 37279051 | 关于全资子公司完成工商变更登记的公告 | 2022-05-05 | Chinese | ||
| 37279046 | 2022年一季度报告 | 2022-04-26 | Chinese | ||
| 37279026 | 第四届监事会第十九次会议决议公告 | 2022-04-26 | Chinese | ||
| 37279017 | 第四届董事会第二十三次会议决议公告 | 2022-04-26 | Chinese | ||
| 37279010 | 2022年第一季度报告披露提示性公告 | 2022-04-26 | Chinese | ||
| 37278998 | 2021年年度股东大会的法律意见书 | 2022-04-26 | Chinese | ||
| 37278986 | 2021年年度股东大会决议公告 | 2022-04-26 | Chinese | ||
| 37278976 | 关于控股股东进行股票质押式回购交易补充质押的公告 | 2022-04-26 | Chinese | ||
| 37278968 | 中泰证券股份有限公司关于公司2021年度持续督导跟踪报告 | 2022-04-22 | Chinese | ||
| 37278957 | 关于召开2021年年度股东大会的提示性公告 | 2022-04-21 | Chinese | ||
| 37278945 | 中泰证券股份有限公司关于公司非公开发行股票之保荐总结报告书 | 2022-04-19 | Chinese | ||
| 37278935 | 关于控股子公司签署《战略合作框架协议》的公告 | 2022-04-01 | Chinese | ||
| 37278927 | 2021年度募集资金存放与使用情况鉴证报告 | 2022-03-30 | Chinese | ||
Market data
Market data not available
Price history
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Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
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