Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 关于受让北京极芯传感科技中心（有限合伙）合伙份额的公告 | 2022-07-01 | Chinese | |
| 关于股东权益变动的提示性公告 | 2022-06-29 | Chinese | |
| 简式权益变动报告书 | 2022-06-29 | Chinese | |
| 关于控股子公司完成工商变更登记的公告 | 2022-06-28 | Chinese | |
| 关于控股股东进行股票质押式回购交易补充质押、质押展期及解除质押的公告 | 2022-06-24 | Chinese | |
| 关于签订募集资金四方监管协议的公告 | 2022-06-17 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2022
15 filings
| |||||
| 37279232 | 关于受让北京极芯传感科技中心（有限合伙）合伙份额的公告 | 2022-07-01 | Chinese | ||
| 37279226 | 关于股东权益变动的提示性公告 | 2022-06-29 | Chinese | ||
| 37279218 | 简式权益变动报告书 | 2022-06-29 | Chinese | ||
| 37279214 | 关于控股子公司完成工商变更登记的公告 | 2022-06-28 | Chinese | ||
| 37279207 | 关于控股股东进行股票质押式回购交易补充质押、质押展期及解除质押的公告 | 2022-06-24 | Chinese | ||
| 37279195 | 关于签订募集资金四方监管协议的公告 | 2022-06-17 | Chinese | ||
| 37279185 | 关于控股子公司签署《战略合作框架协议之补充协议》的公告 | 2022-06-17 | Chinese | ||
| 37279140 | 关于参股子公司完成工商变更登记的公告 | 2022-06-14 | Chinese | ||
| 37279124 | 关于控股子公司BAW滤波器通过验证并启动试产的公告 | 2022-06-13 | Chinese | ||
| 37279113 | 关于完成工商变更登记的公告 | 2022-06-09 | Chinese | ||
| 37279106 | 关于参股子公司完成工商注册登记的公告 | 2022-06-09 | Chinese | ||
| 37279098 | 关于全资子公司对外投资的公告 | 2022-06-02 | Chinese | ||
| 37279092 | 关于控股子公司对外投资设立参股子公司的公告 | 2022-05-30 | Chinese | ||
| 37279083 | 关于控股子公司股权变动的公告 | 2022-05-30 | Chinese | ||
| 37279077 | 关于控股子公司被认定为北京市专精特新中小企业的公告 | 2022-05-20 | Chinese | ||
Market data
Market data not available
Price history
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Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
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