
Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 第四届董事会第二十五次会议决议公告 | 2022-10-26 | Chinese | |
| 2022年三季度报告 | 2022-10-26 | Chinese | |
| 关于延期披露2022年第三季度报告的公告 | 2022-10-24 | Chinese | |
| 关于全资子公司变更名称、经营范围及完成工商变更登记的公告 | 2022-10-11 | Chinese | |
| 关于控股股东部分股票质押展期的公告 | 2022-10-09 | Chinese | |
| 关于中测耐威科技(北京)有限公司完成工商变更登记的公告 | 2022-10-09 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2022
15 filings
| |||||
| 37279776 | 第四届董事会第二十五次会议决议公告 | 2022-10-26 | Chinese | ||
| 37279768 | 2022年三季度报告 | 2022-10-26 | Chinese | ||
| 37279739 | 关于延期披露2022年第三季度报告的公告 | 2022-10-24 | Chinese | ||
| 37279727 | 关于全资子公司变更名称、经营范围及完成工商变更登记的公告 | 2022-10-11 | Chinese | ||
| 37279708 | 关于控股股东部分股票质押展期的公告 | 2022-10-09 | Chinese | ||
| 37279696 | 关于中测耐威科技(北京)有限公司完成工商变更登记的公告 | 2022-10-09 | Chinese | ||
| 37279686 | 中泰证券股份有限公司关于公司2022年半年度持续督导跟踪报告 | 2022-09-09 | Chinese | ||
| 37279674 | 2022年半年度报告摘要 | 2022-08-25 | Chinese | ||
| 37279658 | 2022年半年度非经营性资金占用及其他关联资金往来情况汇总表 | 2022-08-25 | Chinese | ||
| 37279631 | 关于控股股东部分股票质押展期的公告 | 2022-08-25 | Chinese | ||
| 37279623 | 关于为全资子公司申请银行授信提供担保的公告 | 2022-08-25 | Chinese | ||
| 37279609 | 2022年半年度报告 | 2022-08-25 | Chinese | ||
| 37279396 | 关于转让全资子公司股权的公告 | 2022-08-25 | Chinese | ||
| 37279385 | 中泰证券股份有限公司关于公司控股股东为公司申请银行授信提供关联担保的核查意见 | 2022-08-25 | Chinese | ||
| 37279375 | 独立董事关于第四届董事会第二十四次会议相关事项的事前认可意见 | 2022-08-25 | Chinese | ||
Market data
Market data not available
Price history
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Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
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