Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 2022年半年度报告披露提示性公告 | 2022-08-25 | Chinese | |
| 关于控股股东为公司及子公司申请银行授信提供关联担保的公告 | 2022-08-25 | Chinese | |
| 关于公司及子公司向银行申请综合授信额度的公告 | 2022-08-25 | Chinese | |
| 关于控股子公司增资暨关联交易的公告 | 2022-08-25 | Chinese | |
| 独立董事关于第四届董事会第二十四次会议相关事项的独立意见 | 2022-08-25 | Chinese | |
| 监事会决议公告 | 2022-08-25 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2022
15 filings
| |||||
| 37279364 | 2022年半年度报告披露提示性公告 | 2022-08-25 | Chinese | ||
| 37279357 | 关于控股股东为公司及子公司申请银行授信提供关联担保的公告 | 2022-08-25 | Chinese | ||
| 37279346 | 关于公司及子公司向银行申请综合授信额度的公告 | 2022-08-25 | Chinese | ||
| 37279338 | 关于控股子公司增资暨关联交易的公告 | 2022-08-25 | Chinese | ||
| 37279330 | 独立董事关于第四届董事会第二十四次会议相关事项的独立意见 | 2022-08-25 | Chinese | ||
| 37279321 | 监事会决议公告 | 2022-08-25 | Chinese | ||
| 37279316 | 关于2022年半年度募集资金存放与使用情况的专项报告 | 2022-08-25 | Chinese | ||
| 37279306 | 中泰证券股份有限公司关于公司控股子公司增资暨关联交易的核查意见 | 2022-08-25 | Chinese | ||
| 37279289 | 董事会决议公告 | 2022-08-25 | Chinese | ||
| 37279280 | 关于控股子公司获得政府补助的公告 | 2022-08-24 | Chinese | ||
| 37279274 | 关于控股子公司获得政府补助的公告 | 2022-08-05 | Chinese | ||
| 37279268 | 关于控股股东部分股票质押展期的公告 | 2022-08-01 | Chinese | ||
| 37279258 | 关于北京极芯传感科技中心（有限合伙）完成工商变更登记的公告 | 2022-07-19 | Chinese | ||
| 37279253 | 北京赛微电子股份有限公司2022年半年度业绩预告 | 2022-07-14 | Chinese | ||
| 37279241 | 关于控股股东部分股票质押展期的公告 | 2022-07-08 | Chinese | ||
Market data
Market data not available
Price history
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Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
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