
Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 关于公司2021年度控股股东及其他关联方资金占用情况的专项说明 | 2022-03-30 | Chinese | |
| 2021年度董事会工作报告 | 2022-03-30 | Chinese | |
| 2021年第三季度报告(更新后) | 2022-03-30 | Chinese | |
| 控股股东和实际控制人行为规范(2022年3月) | 2022-03-30 | Chinese | |
| 募集资金管理制度(2022年3月) | 2022-03-30 | Chinese | |
| 关联交易管理制度(2022年3月) | 2022-03-30 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2022
15 filings
| |||||
| 37278901 | 关于公司2021年度控股股东及其他关联方资金占用情况的专项说明 | 2022-03-30 | Chinese | ||
| 37278878 | 2021年度董事会工作报告 | 2022-03-30 | Chinese | ||
| 37278845 | 2021年第三季度报告(更新后) | 2022-03-30 | Chinese | ||
| 37278820 | 控股股东和实际控制人行为规范(2022年3月) | 2022-03-30 | Chinese | ||
| 37278808 | 募集资金管理制度(2022年3月) | 2022-03-30 | Chinese | ||
| 37278799 | 关联交易管理制度(2022年3月) | 2022-03-30 | Chinese | ||
| 37278788 | 关于2021年度计提资产减值准备的公告 | 2022-03-30 | Chinese | ||
| 37278775 | 关于变更注册资本并修订《公司章程》的公告 | 2022-03-30 | Chinese | ||
| 37278758 | 2021年度独立董事述职报告(景贵飞) | 2022-03-30 | Chinese | ||
| 37278736 | 关于北京耐威时代科技有限公司完成工商变更登记的公告 | 2022-03-30 | Chinese | ||
| 37278729 | 中泰证券股份有限公司关于公司2021年度募集资金存放与使用情况的专项核查意见 | 2022-03-30 | Chinese | ||
| 37278713 | 战略委员会工作细则(2022年3月) | 2022-03-30 | Chinese | ||
| 37278699 | 提名委员会工作细则(2022年3月) | 2022-03-30 | Chinese | ||
| 37278692 | 投资者关系管理制度(2022年3月) | 2022-03-30 | Chinese | ||
| 37278681 | 董事、监事、高级管理人员薪酬管理制度(2022年3月) | 2022-03-30 | Chinese | ||
Market data
Market data not available
Price history
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Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
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