Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 对外投资管理制度（2022年3月） | 2022-03-30 | Chinese | |
| 董事会议事规则（2022年3月） | 2022-03-30 | Chinese | |
| 关于举行2021年度网上业绩说明会的公告 | 2022-03-30 | Chinese | |
| 关于2021年度利润分配预案的公告 | 2022-03-30 | Chinese | |
| 2021年年度报告披露提示性公告 | 2022-03-30 | Chinese | |
| 2021年年度报告摘要 | 2022-03-30 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2022
15 filings
| |||||
| 37278341 | 对外投资管理制度（2022年3月） | 2022-03-30 | Chinese | ||
| 37278335 | 董事会议事规则（2022年3月） | 2022-03-30 | Chinese | ||
| 37278329 | 关于举行2021年度网上业绩说明会的公告 | 2022-03-30 | Chinese | ||
| 37278321 | 关于2021年度利润分配预案的公告 | 2022-03-30 | Chinese | ||
| 37278315 | 2021年年度报告披露提示性公告 | 2022-03-30 | Chinese | ||
| 37278306 | 2021年年度报告摘要 | 2022-03-30 | Chinese | ||
| 37278290 | 2021年度内部控制鉴证报告 | 2022-03-30 | Chinese | ||
| 37278279 | 2021年年度审计报告 | 2022-03-30 | Chinese | ||
| 37278202 | 外汇衍生品交易业务管理制度（2022年3月） | 2022-03-30 | Chinese | ||
| 37278184 | 信息披露管理制度（2022年3月） | 2022-03-30 | Chinese | ||
| 37278170 | 对外担保管理制度（2022年3月） | 2022-03-30 | Chinese | ||
| 37278158 | 关于召开2021年年度股东大会的通知 | 2022-03-30 | Chinese | ||
| 37278148 | 2022年度董事、监事、高级管理人员薪酬方案 | 2022-03-30 | Chinese | ||
| 37278138 | 关于2021年度日常关联交易确认及2022年度日常关联交易预计的公告 | 2022-03-30 | Chinese | ||
| 37278121 | 2021年度财务决算报告 | 2022-03-30 | Chinese | ||
Market data
Market data not available
Price history
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Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
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