Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 关于变更签字注册会计师的公告 | 2026-01-20 | Chinese | |
| 关于股东部分股份被司法冻结的进展公告 | 2026-01-06 | Chinese | |
| 关于股东部分股份被司法冻结的进展公告 | 2026-01-05 | Chinese | |
| 关于股东部分股份被司法冻结的公告 | 2025-12-31 | Chinese | |
| 关于购买北京芯东来半导体科技有限公司部分股权进展暨完成工商变更登记的公告 | 2025-12-31 | Chinese | |
| 关于董事、高级管理人员减持计划实施完毕的公告 | 2025-12-30 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2026
3 filings
| |||||
| 37288545 | 关于变更签字注册会计师的公告 | 2026-01-20 | Chinese | ||
| 37288543 | 关于股东部分股份被司法冻结的进展公告 | 2026-01-06 | Chinese | ||
| 37288537 | 关于股东部分股份被司法冻结的进展公告 | 2026-01-05 | Chinese | ||
|
2025
12 filings
| |||||
| 37288531 | 关于股东部分股份被司法冻结的公告 | 2025-12-31 | Chinese | ||
| 37288530 | 关于购买北京芯东来半导体科技有限公司部分股权进展暨完成工商变更登记的公告 | 2025-12-31 | Chinese | ||
| 37288525 | 关于董事、高级管理人员减持计划实施完毕的公告 | 2025-12-30 | Chinese | ||
| 37288521 | 关于注销募集资金专户的公告 | 2025-12-24 | Chinese | ||
| 37288518 | 关于全资子公司对外投资设立合伙企业的进展公告 | 2025-12-16 | Chinese | ||
| 37288517 | 关于全资子公司对外投资设立的合伙企业完成工商注册登记的公告 | 2025-12-09 | Chinese | ||
| 37288516 | 关于董事、高级管理人员减持股份预披露公告 | 2025-12-05 | Chinese | ||
| 37288510 | 关于控股子公司向银行申请综合授信额度的公告 | 2025-12-05 | Chinese | ||
| 37288505 | 第五届董事会第二十四次会议决议公告 | 2025-12-05 | Chinese | ||
| 37288502 | 关于向银行申请并购贷款的公告 | 2025-12-05 | Chinese | ||
| 37288499 | 关于控股股东为公司申请银行并购贷款及为控股子公司申请银行授信提供关联担保的公告 | 2025-12-05 | Chinese | ||
| 37288498 | 关于为控股子公司申请银行授信提供担保的公告 | 2025-12-05 | Chinese | ||
Market data
Market data not available
Price history
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Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
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