
Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 关于开展外汇衍生品交易业务的公告 | 2026-03-26 | Chinese | |
| 关于召开2025年年度股东会的通知 | 2026-03-26 | Chinese | |
| 关于2025年度控股股东及其他关联方资金占用情况的专项说明 | 2026-03-26 | Chinese | |
| 董事会关于独立董事独立性自查情况的专项意见 | 2026-03-26 | Chinese | |
| 关于控股子公司股权变动的公告 | 2026-03-26 | Chinese | |
| 2026年度董事、高级管理人员薪酬方案 | 2026-03-26 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2026
15 filings
| |||||
| 37288611 | 关于开展外汇衍生品交易业务的公告 | 2026-03-26 | Chinese | ||
| 37288610 | 关于召开2025年年度股东会的通知 | 2026-03-26 | Chinese | ||
| 37288609 | 关于2025年度控股股东及其他关联方资金占用情况的专项说明 | 2026-03-26 | Chinese | ||
| 37288608 | 董事会关于独立董事独立性自查情况的专项意见 | 2026-03-26 | Chinese | ||
| 37288605 | 关于控股子公司股权变动的公告 | 2026-03-26 | Chinese | ||
| 37288600 | 2026年度董事、高级管理人员薪酬方案 | 2026-03-26 | Chinese | ||
| 37288596 | 关于使用部分闲置自有资金进行现金管理的公告 | 2026-03-26 | Chinese | ||
| 37288594 | 2025年度独立董事述职报告(付三中) | 2026-03-26 | Chinese | ||
| 37288593 | 内部控制审计报告 | 2026-03-26 | Chinese | ||
| 37288589 | 董事、高级管理人员薪酬管理制度(2026年3月) | 2026-03-26 | Chinese | ||
| 37288588 | 关于2025年度日常关联交易确认及2026年度日常关联交易预计的公告 | 2026-03-26 | Chinese | ||
| 37288586 | 2025年度证券与衍生品投资情况的专项报告 | 2026-03-26 | Chinese | ||
| 37288585 | 关于青岛展诚科技有限公司2025年度业绩承诺实现情况的公告 | 2026-03-26 | Chinese | ||
| 37288583 | 关于会计师事务所2025年度履职情况的评估报告 | 2026-03-26 | Chinese | ||
| 37288581 | 董事会审计委员会对会计师事务所2025年度履职情况履行监督职责情况报告 | 2026-03-26 | Chinese | ||
Market data
Market data not available
Price history
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Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
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