Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 2025年度控股股东及其他关联方资金占用情况汇总表 | 2026-03-26 | Chinese | |
| 2025年度董事会工作报告 | 2026-03-26 | Chinese | |
| 中泰证券股份有限公司关于公司2025年度募集资金存放、管理与使用情况的专项核查意见 | 2026-03-26 | Chinese | |
| 关于“质量回报双提升”行动方案的进展公告 | 2026-03-26 | Chinese | |
| 关于香港全资子公司变更记账本位币的公告 | 2026-03-26 | Chinese | |
| 第五届董事会第二十五次会议决议公告 | 2026-03-26 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2026
15 filings
| |||||
| 37288580 | 2025年度控股股东及其他关联方资金占用情况汇总表 | 2026-03-26 | Chinese | ||
| 37288578 | 2025年度董事会工作报告 | 2026-03-26 | Chinese | ||
| 37288572 | 中泰证券股份有限公司关于公司2025年度募集资金存放、管理与使用情况的专项核查意见 | 2026-03-26 | Chinese | ||
| 37288570 | 关于“质量回报双提升”行动方案的进展公告 | 2026-03-26 | Chinese | ||
| 37288569 | 关于香港全资子公司变更记账本位币的公告 | 2026-03-26 | Chinese | ||
| 37288564 | 第五届董事会第二十五次会议决议公告 | 2026-03-26 | Chinese | ||
| 37288563 | 关于2025年度利润分配预案的公告 | 2026-03-26 | Chinese | ||
| 37288562 | 2025年度募集资金存放、管理与使用情况鉴证报告 | 2026-03-26 | Chinese | ||
| 37288561 | 关于2025年度营业收入扣除情况的专项审核报告 | 2026-03-26 | Chinese | ||
| 37288559 | 2025年年度审计报告 | 2026-03-26 | Chinese | ||
| 37288556 | 关于股东部分股份被司法冻结的进展公告 | 2026-03-24 | Chinese | ||
| 37288555 | 关于控股子公司完成工商变更登记的公告 | 2026-01-30 | Chinese | ||
| 37288553 | 2025年年度业绩预告 | 2026-01-27 | Chinese | ||
| 37288551 | 关于控股子公司退回部分政府补助的公告 | 2026-01-27 | Chinese | ||
| 37288549 | 关于股东部分股份被司法冻结的进展公告 | 2026-01-27 | Chinese | ||
Market data
Market data not available
Price history
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Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
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