Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 第五届董事会第二十二次会议决议公告 | 2025-10-27 | Chinese | |
| 2025年三季度报告 | 2025-10-27 | Chinese | |
| 2025年第三季度报告披露提示性公告 | 2025-10-27 | Chinese | |
| 关于2025年前三季度计提资产减值准备的公告 | 2025-10-27 | Chinese | |
| 关于控股股东进行股票质押式回购交易及部分股票质押提前购回的公告 | 2025-10-22 | Chinese | |
| 关于青岛展诚科技有限公司完成工商变更登记的公告 | 2025-09-30 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2025
15 filings
| |||||
| 37288400 | 第五届董事会第二十二次会议决议公告 | 2025-10-27 | Chinese | ||
| 37288396 | 2025年三季度报告 | 2025-10-27 | Chinese | ||
| 37288395 | 2025年第三季度报告披露提示性公告 | 2025-10-27 | Chinese | ||
| 37288392 | 关于2025年前三季度计提资产减值准备的公告 | 2025-10-27 | Chinese | ||
| 37288383 | 关于控股股东进行股票质押式回购交易及部分股票质押提前购回的公告 | 2025-10-22 | Chinese | ||
| 37288378 | 关于青岛展诚科技有限公司完成工商变更登记的公告 | 2025-09-30 | Chinese | ||
| 37288373 | 关于持股5%以上股东减持股份触及1%整数倍的公告 | 2025-09-22 | Chinese | ||
| 37288371 | 关于控股股东进行股票质押式回购交易的公告 | 2025-09-17 | Chinese | ||
| 37288361 | 关于为全资子公司申请银行并购贷款提供担保的公告 | 2025-09-10 | Chinese | ||
| 37288355 | 关于全资子公司向银行申请并购贷款的公告 | 2025-09-10 | Chinese | ||
| 37288349 | 关于控股股东为全资子公司申请银行并购贷款提供关联担保的公告 | 2025-09-10 | Chinese | ||
| 37288342 | 第五届董事会第二十一次会议决议公告 | 2025-09-10 | Chinese | ||
| 37288335 | 关于控股股东进行股票质押式回购交易及部分股票质押提前购回的公告 | 2025-09-05 | Chinese | ||
| 37288331 | 关于全资子公司收购控股子公司部分股权暨关联交易的进展公告 | 2025-09-05 | Chinese | ||
| 37288322 | 关于2025年半年度募集资金存放与使用情况的专项报告 | 2025-08-26 | Chinese | ||
Market data
Market data not available
Price history
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Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
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